Filter Your Search
1 - 10 of 18 results
|
S29AL008D55BAIR22
Spansion
|
Check for Price | No | Obsolete | 8.3886 Mbit | 16 | 16K,8K,32K,64K | 512KX16 | 3.3 V | 55 ns | FLASH | BOTTOM BOOT BLOCK | 8 | BOTTOM | YES | YES | 1000000 Write/Erase Cycles | 1 | 1,2,1,15 | 512000 | 524.288 k | ASYNCHRONOUS | PARALLEL | 3 V | YES | 5 µA | 35 µA | 3.6 V | 3 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B48 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 260 | 48 | PLASTIC/EPOXY | VFBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | TIN LEAD | BALL | 800 µm | BOTTOM | 1 mm | 8.15 mm | 6.15 mm | SPANSION INC | BGA | 8.15 X 6.15 MM, FBGA-48 | 48 | not_compliant | EAR99 | 8542.32.00.51 | ||
|
S29AL008D55BAIR20
AMD
|
Check for Price | No | Transferred | 8.3886 Mbit | 16 | 16K,8K,32K,64K | 512KX16 | 3.3 V | 55 ns | FLASH | 8 | BOTTOM | YES | YES | 1000000 Write/Erase Cycles | 1,2,1,15 | 512000 | 524.288 k | PARALLEL | YES | 5 µA | 35 µA | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B48 | Not Qualified | e0 | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | FBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | Tin/Lead (Sn/Pb) | BALL | 800 µm | BOTTOM | ADVANCED MICRO DEVICES INC | unknown | EAR99 | 8542.32.00.51 | ||||||||||||||||
|
S29AL008D55BAIR10
Spansion
|
Check for Price | No | Obsolete | 8.3886 Mbit | 16 | 16K,8K,32K,64K | 512KX16 | 3.3 V | 55 ns | FLASH | TOP BOOT BLOCK | 8 | TOP | YES | YES | 1000000 Write/Erase Cycles | 1 | 1,2,1,15 | 512000 | 524.288 k | ASYNCHRONOUS | PARALLEL | 3 V | YES | 5 µA | 35 µA | 3.6 V | 3 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B48 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 260 | 48 | PLASTIC/EPOXY | VFBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | TIN LEAD | BALL | 800 µm | BOTTOM | 1 mm | 8.15 mm | 6.15 mm | SPANSION INC | BGA | 8.15 X 6.15 MM, FBGA-48 | 48 | not_compliant | EAR99 | 8542.32.00.51 | ||
|
S29AL008D55BAIR13
Spansion
|
Check for Price | No | Obsolete | 8.3886 Mbit | 16 | 16K,8K,32K,64K | 512KX16 | 3.3 V | 55 ns | FLASH | TOP BOOT BLOCK | 8 | TOP | YES | YES | 1000000 Write/Erase Cycles | 1 | 1,2,1,15 | 512000 | 524.288 k | ASYNCHRONOUS | PARALLEL | 3 V | YES | 5 µA | 35 µA | 3.6 V | 3 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B48 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 260 | 48 | PLASTIC/EPOXY | VFBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | TIN LEAD | BALL | 800 µm | BOTTOM | 1 mm | 8.15 mm | 6.15 mm | SPANSION INC | BGA | 8.15 X 6.15 MM, FBGA-48 | 48 | not_compliant | EAR99 | 8542.32.00.51 | ||
|
S29AL008D55BAIR12
AMD
|
Check for Price | No | Transferred | 8.3886 Mbit | 16 | 16K,8K,32K,64K | 512KX16 | 3.3 V | 55 ns | FLASH | 8 | TOP | YES | YES | 1000000 Write/Erase Cycles | 1,2,1,15 | 512000 | 524.288 k | PARALLEL | YES | 5 µA | 35 µA | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B48 | Not Qualified | e0 | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | FBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | Tin/Lead (Sn/Pb) | BALL | 800 µm | BOTTOM | ADVANCED MICRO DEVICES INC | FBGA, BGA48,6X8,32 | unknown | EAR99 | 8542.32.00.51 | |||||||||||||||
|
S29AL008D55BAIR20
Spansion
|
Check for Price | No | Obsolete | 8.3886 Mbit | 16 | 16K,8K,32K,64K | 512KX16 | 3.3 V | 55 ns | FLASH | BOTTOM BOOT BLOCK | 8 | BOTTOM | YES | YES | 1000000 Write/Erase Cycles | 1 | 1,2,1,15 | 512000 | 524.288 k | ASYNCHRONOUS | PARALLEL | 3 V | YES | 5 µA | 35 µA | 3.6 V | 3 V | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B48 | Not Qualified | e0 | 3 | 85 °C | -40 °C | 260 | 48 | PLASTIC/EPOXY | VFBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | TIN LEAD | BALL | 800 µm | BOTTOM | 1 mm | 8.15 mm | 6.15 mm | SPANSION INC | BGA | 8.15 X 6.15 MM, FBGA-48 | 48 | not_compliant | EAR99 | 8542.32.00.51 | ||
|
S29AL008D55BAIR22
Cypress Semiconductor
|
Check for Price | No | Obsolete | 8.3886 Mbit | 16 | 512KX16 | 3.3 V | 55 ns | FLASH | BOTTOM BOOT BLOCK | 8 | BOTTOM | 1 | 512000 | 524.288 k | ASYNCHRONOUS | PARALLEL | 3 V | 35 µA | 3.6 V | 3 V | CMOS | INDUSTRIAL | NOR TYPE | R-PBGA-B48 | e0 | 3 | 85 °C | -40 °C | 260 | 48 | PLASTIC/EPOXY | VFBGA | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | TIN LEAD | BALL | 800 µm | BOTTOM | 1 mm | 8.15 mm | 6.15 mm | CYPRESS SEMICONDUCTOR CORP | VFBGA, | compliant | EAR99 | 8542.32.00.51 | ||||||||||||||
|
S29AL008D55BAIR10
AMD
|
Check for Price | No | Transferred | 8.3886 Mbit | 16 | 16K,8K,32K,64K | 512KX16 | 3.3 V | 55 ns | FLASH | 8 | TOP | YES | YES | 1000000 Write/Erase Cycles | 1,2,1,15 | 512000 | 524.288 k | PARALLEL | YES | 5 µA | 35 µA | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B48 | Not Qualified | e0 | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | FBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | Tin/Lead (Sn/Pb) | BALL | 800 µm | BOTTOM | ADVANCED MICRO DEVICES INC | FBGA, BGA48,6X8,32 | unknown | EAR99 | 8542.32.00.51 | |||||||||||||||
|
S29AL008D55BAIR22
AMD
|
Check for Price | No | Transferred | 8.3886 Mbit | 16 | 16K,8K,32K,64K | 512KX16 | 3.3 V | 55 ns | FLASH | 8 | BOTTOM | YES | YES | 1000000 Write/Erase Cycles | 1,2,1,15 | 512000 | 524.288 k | PARALLEL | YES | 5 µA | 35 µA | CMOS | INDUSTRIAL | YES | NOR TYPE | R-PBGA-B48 | Not Qualified | e0 | 85 °C | -40 °C | 48 | PLASTIC/EPOXY | FBGA | BGA48,6X8,32 | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | Tin/Lead (Sn/Pb) | BALL | 800 µm | BOTTOM | ADVANCED MICRO DEVICES INC | unknown | EAR99 | 8542.32.00.51 | ||||||||||||||||
|
S29AL008D55BAIR23
Cypress Semiconductor
|
Check for Price | No | Obsolete | 8.3886 Mbit | 16 | 512KX16 | 3.3 V | 55 ns | FLASH | BOTTOM BOOT BLOCK | 8 | BOTTOM | 1 | 512000 | 524.288 k | ASYNCHRONOUS | PARALLEL | 3 V | 35 µA | 3.6 V | 3 V | CMOS | INDUSTRIAL | NOR TYPE | R-PBGA-B48 | e0 | 3 | 85 °C | -40 °C | 260 | 48 | PLASTIC/EPOXY | VFBGA | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | TIN LEAD | BALL | 800 µm | BOTTOM | 1 mm | 8.15 mm | 6.15 mm | CYPRESS SEMICONDUCTOR CORP | VFBGA, | compliant | EAR99 | 8542.32.00.51 |