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Parametric » Memory » Flash Memories

Parametric results for: S29JL064H55BAI000 under Flash Memories

Select parts from the table below to compare.

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Select Parts		Part Number

		S29JL064H55BAI000 Cypress Semiconductor
		S29JL064H55BAI000 AMD
		S29JL064H55BAI000 Spansion

				Most Relevant						Technical																						Compliance			Operating Conditions				Physical											Dimensions			Other
Composite Price	Pbfree Code	Rohs Code	Part Life Cycle Code	Memory Density	Memory Width	Sector Size	Organization	Supply Voltage-Nom (Vsup)	Access Time-Max	Memory IC Type	Alternate Memory Width	Boot Block	Command User Interface	Common Flash Interface	Data Polling	Number of Functions	Number of Sectors/Size	Number of Words Code	Number of Words	Operating Mode	Parallel/Serial	Programming Voltage	Ready/Busy	Standby Current-Max	Supply Current-Max	Supply Voltage-Max (Vsup)	Supply Voltage-Min (Vsup)	Technology	Temperature Grade	Toggle Bit	Type	JESD-30 Code	Qualification Status	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Surface Mount	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Length	Width	Ihs Manufacturer	Package Description	Reach Compliance Code	ECCN Code	HTS Code	Part Package Code	Pin Count

Check for Price

No

Obsolete

67.1089 Mbit

16

4MX16

3 V

55 ns

FLASH

8

BOTTOM/TOP

1

4000000

4.1943 M

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B63

e0

3

85 °C

-40 °C

260

63

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.2 mm

12 mm

11 mm

CYPRESS SEMICONDUCTOR CORP

12 X 11 MM, FPBGA-63

compliant

EAR99

8542.32.00.51

Check for Price

No

Transferred

67.1089 Mbit

16

8K,64K

4MX16

55 ns

FLASH

8

BOTTOM/TOP

YES

YES

YES

16,126

4000000

4.1943 M

PARALLEL

YES

5 µA

45 µA

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B63

Not Qualified

e0

85 °C

-40 °C

63

PLASTIC/EPOXY

FBGA

BGA63,8X12,32

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

ADVANCED MICRO DEVICES INC

FBGA, BGA63,8X12,32

unknown

EAR99

8542.32.00.51

Check for Price

No

No

Obsolete

67.1089 Mbit

16

8K,64K

4MX16

3 V

55 ns

FLASH

8

BOTTOM/TOP

YES

YES

YES

1

16,126

4000000

4.1943 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B63

Not Qualified

e0

3

85 °C

-40 °C

260

63

PLASTIC/EPOXY

TFBGA

BGA63,8X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.2 mm

12 mm

11 mm

SPANSION INC

12 X 11 MM, FPBGA-63

not_compliant

EAR99

8542.32.00.51

BGA

63

Compare

S29JL064H55BAI000

Cypress Semiconductor

Check for Price

No

Obsolete

67.1089 Mbit

16

4MX16

3 V

55 ns

FLASH

8

BOTTOM/TOP

1

4000000

4.1943 M

ASYNCHRONOUS

PARALLEL

3 V

3.6 V

2.7 V

CMOS

INDUSTRIAL

NOR TYPE

R-PBGA-B63

e0

3

85 °C

-40 °C

260

63

PLASTIC/EPOXY

TFBGA

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.2 mm

12 mm

11 mm

CYPRESS SEMICONDUCTOR CORP

12 X 11 MM, FPBGA-63

compliant

EAR99

8542.32.00.51

S29JL064H55BAI000

AMD

Check for Price

No

Transferred

67.1089 Mbit

16

8K,64K

4MX16

55 ns

FLASH

8

BOTTOM/TOP

YES

YES

YES

16,126

4000000

4.1943 M

PARALLEL

YES

5 µA

45 µA

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B63

Not Qualified

e0

85 °C

-40 °C

63

PLASTIC/EPOXY

FBGA

BGA63,8X12,32

RECTANGULAR

GRID ARRAY, FINE PITCH

YES

Tin/Lead (Sn/Pb)

BALL

800 µm

BOTTOM

ADVANCED MICRO DEVICES INC

FBGA, BGA63,8X12,32

unknown

EAR99

8542.32.00.51

S29JL064H55BAI000

Spansion

Check for Price

No

No

Obsolete

67.1089 Mbit

16

8K,64K

4MX16

3 V

55 ns

FLASH

8

BOTTOM/TOP

YES

YES

YES

1

16,126

4000000

4.1943 M

ASYNCHRONOUS

PARALLEL

3 V

YES

5 µA

45 µA

3.6 V

2.7 V

CMOS

INDUSTRIAL

YES

NOR TYPE

R-PBGA-B63

Not Qualified

e0

3

85 °C

-40 °C

260

63

PLASTIC/EPOXY

TFBGA

BGA63,8X12,32

RECTANGULAR

GRID ARRAY, THIN PROFILE, FINE PITCH

YES

TIN LEAD

BALL

800 µm

BOTTOM

1.2 mm

12 mm

11 mm

SPANSION INC

12 X 11 MM, FPBGA-63

not_compliant

EAR99

8542.32.00.51

BGA

63