Parametric results for: S29NS032JPLBFW002 under Flash Memories

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Manufacturer Part Number: s29ns032j
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S29NS032J0LBFW00
Cypress Semiconductor
Check for Price Yes Transferred 33.5544 Mbit 16 8K,32K 2MX16 1.8 V 70 ns FLASH TOP YES YES YES 4,63 2000000 2.0972 M PARALLEL YES 40 µA 60 µA CMOS OTHER YES NOR TYPE R-PBGA-B44 Not Qualified e1 3 85 °C -25 °C 260 40 44 PLASTIC/EPOXY FBGA BGA44,8X14,20 RECTANGULAR GRID ARRAY, FINE PITCH YES TIN SILVER COPPER BALL 500 µm BOTTOM CYPRESS SEMICONDUCTOR CORP compliant EAR99 8542.32.00.51
S29NS032J0PBFW00
Spansion
Check for Price Yes Transferred 33.5544 Mbit 16 8K,32K 2MX16 1.8 V 65 ns FLASH TOP YES YES YES 4,63 2000000 2.0972 M PARALLEL YES 40 µA 60 µA CMOS OTHER YES NOR TYPE R-PBGA-B44 Not Qualified e1 3 85 °C -25 °C 260 40 44 PLASTIC/EPOXY FBGA BGA44,8X14,20 RECTANGULAR GRID ARRAY, FINE PITCH YES TIN SILVER COPPER BALL 500 µm BOTTOM SPANSION INC unknown EAR99 8542.32.00.51 FBGA, BGA44,8X14,20
S29NS032J0LBJW003
Spansion
Check for Price Yes Obsolete 33.5544 Mbit 16 8K,32K 2MX16 1.8 V 70 ns FLASH SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE TOP YES YES YES 1 4,63 2000000 2.0972 M ASYNCHRONOUS PARALLEL 1.8 V YES 40 µA 60 µA 1.95 V 1.7 V CMOS OTHER YES NOR TYPE 80 ms R-PBGA-B44 Not Qualified e1 3 85 °C -25 °C 260 40 44 PLASTIC/EPOXY VFBGA BGA44,8X14,20 RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 500 µm BOTTOM 1 mm 7.7 mm 6.2 mm SPANSION INC unknown EAR99 8542.32.00.51 7.70 X 6.20 MM, LEAD FREE, FBGA-44 BGA 44
S29NS032J0PBJW000
Spansion
Check for Price Yes Yes Obsolete 33.5544 Mbit 16 8K,32K 2MX16 1.8 V 65 ns FLASH SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE TOP YES YES YES 1 4,63 2000000 2.0972 M ASYNCHRONOUS PARALLEL 1.8 V YES 40 µA 60 µA 1.95 V 1.7 V CMOS OTHER YES NOR TYPE 45 ms R-PBGA-B44 Not Qualified e1 3 85 °C -25 °C 260 40 44 PLASTIC/EPOXY VFBGA BGA44,8X14,20 RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 500 µm BOTTOM 1 mm 7.7 mm 6.2 mm SPANSION INC unknown EAR99 8542.32.00.51 7.70 X 6.20 MM, LEAD FREE, FBGA-44 BGA 44
S29NS032J0PBFW00
Cypress Semiconductor
Check for Price Yes Transferred 33.5544 Mbit 16 8K,32K 2MX16 1.8 V 65 ns FLASH TOP YES YES YES 4,63 2000000 2.0972 M PARALLEL YES 40 µA 60 µA CMOS OTHER YES NOR TYPE R-PBGA-B44 Not Qualified e1 3 85 °C -25 °C 260 40 44 PLASTIC/EPOXY FBGA BGA44,8X14,20 RECTANGULAR GRID ARRAY, FINE PITCH YES TIN SILVER COPPER BALL 500 µm BOTTOM CYPRESS SEMICONDUCTOR CORP compliant EAR99 8542.32.00.51
S29NS032J0PBJW002
Spansion
Check for Price Yes Obsolete 33.5544 Mbit 16 8K,32K 2MX16 1.8 V 65 ns FLASH SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE TOP YES YES YES 1 4,63 2000000 2.0972 M ASYNCHRONOUS PARALLEL 1.8 V YES 40 µA 60 µA 1.95 V 1.7 V CMOS OTHER YES NOR TYPE 45 ms R-PBGA-B44 Not Qualified e1 3 85 °C -25 °C 260 40 44 PLASTIC/EPOXY VFBGA BGA44,8X14,20 RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 500 µm BOTTOM 1 mm 7.7 mm 6.2 mm SPANSION INC unknown EAR99 8542.32.00.51 7.70 X 6.20 MM, LEAD FREE, FBGA-44 BGA 44
S29NS032J0LBFW000
Spansion
Check for Price Yes Obsolete 33.5544 Mbit 16 8K,32K 2MX16 1.8 V 70 ns FLASH SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE TOP YES YES YES 1 4,63 2000000 2.0972 M ASYNCHRONOUS PARALLEL 1.8 V YES 40 µA 60 µA 1.95 V 1.7 V CMOS OTHER YES NOR TYPE 80 ms R-PBGA-B44 Not Qualified e1 3 85 °C -25 °C 260 40 44 PLASTIC/EPOXY VFBGA BGA44,8X14,20 RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 500 µm BOTTOM 1 mm 7.7 mm 6.2 mm SPANSION INC unknown EAR99 8542.32.00.51 7.70 X 6.20 MM, LEAD FREE, FBGA-44 BGA 44
S29NS032J0LBFW002
Spansion
Check for Price Yes Obsolete 33.5544 Mbit 16 8K,32K 2MX16 1.8 V 70 ns FLASH SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE TOP YES YES YES 1 4,63 2000000 2.0972 M ASYNCHRONOUS PARALLEL 1.8 V YES 40 µA 60 µA 1.95 V 1.7 V CMOS OTHER YES NOR TYPE 80 ms R-PBGA-B44 Not Qualified e1 3 85 °C -25 °C 260 40 44 PLASTIC/EPOXY VFBGA BGA44,8X14,20 RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 500 µm BOTTOM 1 mm 7.7 mm 6.2 mm SPANSION INC unknown EAR99 8542.32.00.51 7.70 X 6.20 MM, LEAD FREE, FBGA-44 BGA 44
S29NS032J0PBFW002
Spansion
Check for Price Yes Obsolete 33.5544 Mbit 16 8K,32K 2MX16 1.8 V 65 ns FLASH SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE TOP YES YES YES 1 4,63 2000000 2.0972 M ASYNCHRONOUS PARALLEL 1.8 V YES 40 µA 60 µA 1.95 V 1.7 V CMOS OTHER YES NOR TYPE 45 ms R-PBGA-B44 Not Qualified e1 3 85 °C -25 °C 260 40 44 PLASTIC/EPOXY VFBGA BGA44,8X14,20 RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 500 µm BOTTOM 1 mm 7.7 mm 6.2 mm SPANSION INC unknown EAR99 8542.32.00.51 7.70 X 6.20 MM, LEAD FREE, FBGA-44 BGA 44
S29NS032J0PBFW003
Spansion
Check for Price Yes Obsolete 33.5544 Mbit 16 8K,32K 2MX16 1.8 V 65 ns FLASH SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE TOP YES YES YES 1 4,63 2000000 2.0972 M ASYNCHRONOUS PARALLEL 1.8 V YES 40 µA 60 µA 1.95 V 1.7 V CMOS OTHER YES NOR TYPE 45 ms R-PBGA-B44 Not Qualified e1 3 85 °C -25 °C 260 40 44 PLASTIC/EPOXY VFBGA BGA44,8X14,20 RECTANGULAR GRID ARRAY, VERY THIN PROFILE, FINE PITCH YES TIN SILVER COPPER BALL 500 µm BOTTOM 1 mm 7.7 mm 6.2 mm SPANSION INC unknown EAR99 8542.32.00.51 7.70 X 6.20 MM, LEAD FREE, FBGA-44 BGA 44