Filter Your Search
1 - 10 of 18 results
|
S29NS032J0LBFW00
Cypress Semiconductor
|
Check for Price | Yes | Transferred | 33.5544 Mbit | 16 | 8K,32K | 2MX16 | 1.8 V | 70 ns | FLASH | TOP | YES | YES | YES | 4,63 | 2000000 | 2.0972 M | PARALLEL | YES | 40 µA | 60 µA | CMOS | OTHER | YES | NOR TYPE | R-PBGA-B44 | Not Qualified | e1 | 3 | 85 °C | -25 °C | 260 | 40 | 44 | PLASTIC/EPOXY | FBGA | BGA44,8X14,20 | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | TIN SILVER COPPER | BALL | 500 µm | BOTTOM | CYPRESS SEMICONDUCTOR CORP | compliant | EAR99 | 8542.32.00.51 | ||||||||||||||||
|
S29NS032J0PBFW00
Spansion
|
Check for Price | Yes | Transferred | 33.5544 Mbit | 16 | 8K,32K | 2MX16 | 1.8 V | 65 ns | FLASH | TOP | YES | YES | YES | 4,63 | 2000000 | 2.0972 M | PARALLEL | YES | 40 µA | 60 µA | CMOS | OTHER | YES | NOR TYPE | R-PBGA-B44 | Not Qualified | e1 | 3 | 85 °C | -25 °C | 260 | 40 | 44 | PLASTIC/EPOXY | FBGA | BGA44,8X14,20 | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | TIN SILVER COPPER | BALL | 500 µm | BOTTOM | SPANSION INC | unknown | EAR99 | 8542.32.00.51 | FBGA, BGA44,8X14,20 | |||||||||||||||
|
S29NS032J0LBJW003
Spansion
|
Check for Price | Yes | Obsolete | 33.5544 Mbit | 16 | 8K,32K | 2MX16 | 1.8 V | 70 ns | FLASH | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE | TOP | YES | YES | YES | 1 | 4,63 | 2000000 | 2.0972 M | ASYNCHRONOUS | PARALLEL | 1.8 V | YES | 40 µA | 60 µA | 1.95 V | 1.7 V | CMOS | OTHER | YES | NOR TYPE | 80 ms | R-PBGA-B44 | Not Qualified | e1 | 3 | 85 °C | -25 °C | 260 | 40 | 44 | PLASTIC/EPOXY | VFBGA | BGA44,8X14,20 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 500 µm | BOTTOM | 1 mm | 7.7 mm | 6.2 mm | SPANSION INC | unknown | EAR99 | 8542.32.00.51 | 7.70 X 6.20 MM, LEAD FREE, FBGA-44 | BGA | 44 | |||
|
S29NS032J0PBJW000
Spansion
|
Check for Price | Yes | Yes | Obsolete | 33.5544 Mbit | 16 | 8K,32K | 2MX16 | 1.8 V | 65 ns | FLASH | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE | TOP | YES | YES | YES | 1 | 4,63 | 2000000 | 2.0972 M | ASYNCHRONOUS | PARALLEL | 1.8 V | YES | 40 µA | 60 µA | 1.95 V | 1.7 V | CMOS | OTHER | YES | NOR TYPE | 45 ms | R-PBGA-B44 | Not Qualified | e1 | 3 | 85 °C | -25 °C | 260 | 40 | 44 | PLASTIC/EPOXY | VFBGA | BGA44,8X14,20 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 500 µm | BOTTOM | 1 mm | 7.7 mm | 6.2 mm | SPANSION INC | unknown | EAR99 | 8542.32.00.51 | 7.70 X 6.20 MM, LEAD FREE, FBGA-44 | BGA | 44 | ||
|
S29NS032J0PBFW00
Cypress Semiconductor
|
Check for Price | Yes | Transferred | 33.5544 Mbit | 16 | 8K,32K | 2MX16 | 1.8 V | 65 ns | FLASH | TOP | YES | YES | YES | 4,63 | 2000000 | 2.0972 M | PARALLEL | YES | 40 µA | 60 µA | CMOS | OTHER | YES | NOR TYPE | R-PBGA-B44 | Not Qualified | e1 | 3 | 85 °C | -25 °C | 260 | 40 | 44 | PLASTIC/EPOXY | FBGA | BGA44,8X14,20 | RECTANGULAR | GRID ARRAY, FINE PITCH | YES | TIN SILVER COPPER | BALL | 500 µm | BOTTOM | CYPRESS SEMICONDUCTOR CORP | compliant | EAR99 | 8542.32.00.51 | ||||||||||||||||
|
S29NS032J0PBJW002
Spansion
|
Check for Price | Yes | Obsolete | 33.5544 Mbit | 16 | 8K,32K | 2MX16 | 1.8 V | 65 ns | FLASH | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE | TOP | YES | YES | YES | 1 | 4,63 | 2000000 | 2.0972 M | ASYNCHRONOUS | PARALLEL | 1.8 V | YES | 40 µA | 60 µA | 1.95 V | 1.7 V | CMOS | OTHER | YES | NOR TYPE | 45 ms | R-PBGA-B44 | Not Qualified | e1 | 3 | 85 °C | -25 °C | 260 | 40 | 44 | PLASTIC/EPOXY | VFBGA | BGA44,8X14,20 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 500 µm | BOTTOM | 1 mm | 7.7 mm | 6.2 mm | SPANSION INC | unknown | EAR99 | 8542.32.00.51 | 7.70 X 6.20 MM, LEAD FREE, FBGA-44 | BGA | 44 | |||
|
S29NS032J0LBFW000
Spansion
|
Check for Price | Yes | Obsolete | 33.5544 Mbit | 16 | 8K,32K | 2MX16 | 1.8 V | 70 ns | FLASH | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE | TOP | YES | YES | YES | 1 | 4,63 | 2000000 | 2.0972 M | ASYNCHRONOUS | PARALLEL | 1.8 V | YES | 40 µA | 60 µA | 1.95 V | 1.7 V | CMOS | OTHER | YES | NOR TYPE | 80 ms | R-PBGA-B44 | Not Qualified | e1 | 3 | 85 °C | -25 °C | 260 | 40 | 44 | PLASTIC/EPOXY | VFBGA | BGA44,8X14,20 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 500 µm | BOTTOM | 1 mm | 7.7 mm | 6.2 mm | SPANSION INC | unknown | EAR99 | 8542.32.00.51 | 7.70 X 6.20 MM, LEAD FREE, FBGA-44 | BGA | 44 | |||
|
S29NS032J0LBFW002
Spansion
|
Check for Price | Yes | Obsolete | 33.5544 Mbit | 16 | 8K,32K | 2MX16 | 1.8 V | 70 ns | FLASH | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE | TOP | YES | YES | YES | 1 | 4,63 | 2000000 | 2.0972 M | ASYNCHRONOUS | PARALLEL | 1.8 V | YES | 40 µA | 60 µA | 1.95 V | 1.7 V | CMOS | OTHER | YES | NOR TYPE | 80 ms | R-PBGA-B44 | Not Qualified | e1 | 3 | 85 °C | -25 °C | 260 | 40 | 44 | PLASTIC/EPOXY | VFBGA | BGA44,8X14,20 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 500 µm | BOTTOM | 1 mm | 7.7 mm | 6.2 mm | SPANSION INC | unknown | EAR99 | 8542.32.00.51 | 7.70 X 6.20 MM, LEAD FREE, FBGA-44 | BGA | 44 | |||
|
S29NS032J0PBFW002
Spansion
|
Check for Price | Yes | Obsolete | 33.5544 Mbit | 16 | 8K,32K | 2MX16 | 1.8 V | 65 ns | FLASH | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE | TOP | YES | YES | YES | 1 | 4,63 | 2000000 | 2.0972 M | ASYNCHRONOUS | PARALLEL | 1.8 V | YES | 40 µA | 60 µA | 1.95 V | 1.7 V | CMOS | OTHER | YES | NOR TYPE | 45 ms | R-PBGA-B44 | Not Qualified | e1 | 3 | 85 °C | -25 °C | 260 | 40 | 44 | PLASTIC/EPOXY | VFBGA | BGA44,8X14,20 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 500 µm | BOTTOM | 1 mm | 7.7 mm | 6.2 mm | SPANSION INC | unknown | EAR99 | 8542.32.00.51 | 7.70 X 6.20 MM, LEAD FREE, FBGA-44 | BGA | 44 | |||
|
S29NS032J0PBFW003
Spansion
|
Check for Price | Yes | Obsolete | 33.5544 Mbit | 16 | 8K,32K | 2MX16 | 1.8 V | 65 ns | FLASH | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE | TOP | YES | YES | YES | 1 | 4,63 | 2000000 | 2.0972 M | ASYNCHRONOUS | PARALLEL | 1.8 V | YES | 40 µA | 60 µA | 1.95 V | 1.7 V | CMOS | OTHER | YES | NOR TYPE | 45 ms | R-PBGA-B44 | Not Qualified | e1 | 3 | 85 °C | -25 °C | 260 | 40 | 44 | PLASTIC/EPOXY | VFBGA | BGA44,8X14,20 | RECTANGULAR | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 500 µm | BOTTOM | 1 mm | 7.7 mm | 6.2 mm | SPANSION INC | unknown | EAR99 | 8542.32.00.51 | 7.70 X 6.20 MM, LEAD FREE, FBGA-44 | BGA | 44 |