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Parametric results for: SIN PWM USING DSPIC33F under Microcontrollers

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Manufacturer Part Number: dspic33f
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DSPIC33FJ32MC202T-I/SO
 Microchip Technology Inc 		$1.0000 Yes Yes Active 16 40 MHz YES 3.3 V DIGITAL SIGNAL PROCESSOR, CONTROLLER CMOS YES FLOATING POINT MULTIPLE FLASH 70 mA 3.6 V 3 V INDUSTRIAL R-PDSO-G28 Not Qualified e3 1 85 °C -40 °C 250 40 28 PLASTIC/EPOXY SOP SOP28,.4 RECTANGULAR SMALL OUTLINE MATTE TIN GULL WING 1.27 mm DUAL 2.65 mm 7.5 mm 17.9 mm MICROCHIP TECHNOLOGY INC SOIC SOP, SOP28,.4 28 compliant 3A991.A.2 8542.31.00.01 Microchip
DSPIC33FJ128GP206T-I/PT
 Microchip Technology Inc 		$1.0000 Yes Yes Not Recommended 16 64 MHz YES 3.3 V DIGITAL SIGNAL PROCESSOR, CONTROLLER CMOS YES FIXED POINT MULTIPLE FLASH 3.6 V 3 V INDUSTRIAL S-PQFP-G64 Not Qualified e3 3 85 °C -40 °C 64 PLASTIC/EPOXY TFQFP TQFP64,.47SQ SQUARE FLATPACK, THIN PROFILE, FINE PITCH MATTE TIN GULL WING 500 µm QUAD 1.2 mm 10 mm 10 mm MICROCHIP TECHNOLOGY INC QFP 10 X 10 MM, 1 MM HEIGHT, PLASTIC, MS-026, TQFP-64 64 compliant 3A991.A.2 8542.31.00.01 Microchip
DSPIC33FJ64GP306T-I/PT
 Microchip Technology Inc 		$1.0000 Yes Yes Not Recommended 16 64 MHz YES 3.3 V DIGITAL SIGNAL PROCESSOR, CONTROLLER CMOS YES FIXED POINT MULTIPLE FLASH 3.6 V 3 V INDUSTRIAL S-PQFP-G64 Not Qualified e3 3 85 °C -40 °C 64 PLASTIC/EPOXY TFQFP TQFP64,.47SQ SQUARE FLATPACK, THIN PROFILE, FINE PITCH MATTE TIN GULL WING 500 µm QUAD 1.2 mm 10 mm 10 mm MICROCHIP TECHNOLOGY INC QFP TFQFP, TQFP64,.47SQ 64 compliant 3A991.A.2 8542.31.00.01 Microchip
DSPIC33FJ32GP202T-I/SS
 Microchip Technology Inc 		$1.0000 Yes Active 16 40 MHz YES 3.3 V DIGITAL SIGNAL PROCESSOR, CONTROLLER CMOS YES MULTIPLE FLASH 80 mA 3.6 V 3 V INDUSTRIAL R-PDSO-G28 Not Qualified e3 2 85 °C -40 °C 260 40 28 PLASTIC/EPOXY SSOP SSOP28,.3 RECTANGULAR SMALL OUTLINE, SHRINK PITCH MATTE TIN GULL WING 650 µm DUAL 2 mm 5.3 mm 10.2 mm MICROCHIP TECHNOLOGY INC SSOP 5.30 MM, LEAD FREE, PLASTIC, SSOP-28 28 compliant 3A991.A.2 8542.31.00.01
DSPIC33FJ12MC202T-I/SO
 Microchip Technology Inc 		$1.0000 Yes Yes Active 16 40 MHz YES 3.3 V DIGITAL SIGNAL PROCESSOR, CONTROLLER CMOS YES FIXED POINT MULTIPLE 24 FLASH 90 mA 3.6 V 3 V INDUSTRIAL R-PDSO-G28 Not Qualified e3 1 85 °C -40 °C 260 40 28 PLASTIC/EPOXY SOP SOP28,.4 RECTANGULAR SMALL OUTLINE MATTE TIN GULL WING 1.27 mm DUAL 2.65 mm 7.5 mm 17.9 mm MICROCHIP TECHNOLOGY INC SOIC 7.50 MM, LEAD FREE, PLASTIC, SOIC-28 28 compliant 3A991.A.2 8542.31.00.01 Microchip
DSPIC33FJ128MC706T-I/PT
 Microchip Technology Inc 		$1.0000 Yes Yes Not Recommended 16 64 MHz YES 3.3 V DIGITAL SIGNAL PROCESSOR, CONTROLLER CMOS YES FIXED POINT MULTIPLE FLASH 3.6 V 3 V INDUSTRIAL S-PQFP-G64 Not Qualified e3 3 85 °C -40 °C 64 PLASTIC/EPOXY TFQFP TQFP64,.47SQ SQUARE FLATPACK, THIN PROFILE, FINE PITCH MATTE TIN GULL WING 500 µm QUAD 1.2 mm 10 mm 10 mm MICROCHIP TECHNOLOGY INC QFP TFQFP, TQFP64,.47SQ 64 compliant 3A991.A.2 8542.31.00.01 Microchip
DSPIC33FJ32GP204T-I/ML
 Microchip Technology Inc 		$1.0000 Yes Yes Active 16 40 MHz YES 3.3 V DIGITAL SIGNAL PROCESSOR, CONTROLLER CMOS YES MULTIPLE FLASH 80 mA 3.6 V 3 V INDUSTRIAL S-PQCC-N44 Not Qualified e3 1 85 °C -40 °C 260 40 44 PLASTIC/EPOXY HVQCCN LCC44,.31SQ,25 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE MATTE TIN NO LEAD 650 µm QUAD 1 mm 8 mm 8 mm MICROCHIP TECHNOLOGY INC QFN 8 X 8 MM, LEAD FREE, PLASTIC, QFN-44 44 compliant 3A991.A.2 8542.31.00.01 Microchip
DSPIC33FJ256GP710T-I/PT
 Microchip Technology Inc 		$1.0000 Yes Yes Not Recommended 16 64 MHz YES 3.3 V DIGITAL SIGNAL PROCESSOR, CONTROLLER CMOS YES FIXED POINT MULTIPLE FLASH 3.6 V 3 V INDUSTRIAL S-PQFP-G100 Not Qualified e3 85 °C -40 °C 260 40 100 PLASTIC/EPOXY TQFP TQFP100,.55SQ,16 SQUARE FLATPACK, THIN PROFILE MATTE TIN GULL WING 400 µm QUAD 1.2 mm 12 mm 12 mm MICROCHIP TECHNOLOGY INC QFP 12 X 12 MM, 1 MM HEIGHT, PLASTIC, MS-026, TQFP-100 100 compliant 3A991.A.2 8542.31.00.01 Microchip
DSPIC33FJ16GP304T-I/ML
 Microchip Technology Inc 		$1.0000 Yes Yes Active 16 40 MHz YES 3.3 V DIGITAL SIGNAL PROCESSOR, CONTROLLER CMOS YES MULTIPLE FLASH 80 mA 3.6 V 3 V INDUSTRIAL S-PQCC-N44 Not Qualified e3 1 85 °C -40 °C 260 40 44 PLASTIC/EPOXY HVQCCN LCC44,.31SQ,25 SQUARE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE MATTE TIN NO LEAD 650 µm QUAD 1 mm 8 mm 8 mm MICROCHIP TECHNOLOGY INC QFN 8 X 8 MM, LEAD FREE, PLASTIC, QFN-44 44 compliant 3A991.A.2 8542.31.00.01 Microchip
DSPIC33FJ128GP306T-I/PT
 Microchip Technology Inc 		$1.0000 Yes Yes Not Recommended 16 64 MHz YES 3.3 V DIGITAL SIGNAL PROCESSOR, CONTROLLER CMOS YES FIXED POINT MULTIPLE FLASH 3.6 V 3 V INDUSTRIAL S-PQFP-G64 Not Qualified e3 3 85 °C -40 °C 64 PLASTIC/EPOXY TFQFP TQFP64,.47SQ SQUARE FLATPACK, THIN PROFILE, FINE PITCH MATTE TIN GULL WING 500 µm QUAD 1.2 mm 10 mm 10 mm MICROCHIP TECHNOLOGY INC QFP 10 X 10 MM, 1 MM HEIGHT, PLASTIC, MS-026, TQFP-64 64 compliant 3A991.A.2 8542.31.00.01 Microchip
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