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W25Q32FVZPIG
Winbond Electronics Corp
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$0.5364 | Yes | Obsolete | 33.5544 Mbit | 1 | 32MX1 | 3 V | 104 MHz | FLASH | 20 | 100000 Write/Erase Cycles | 1 | 32000000 | 33.5544 M | SYNCHRONOUS | SERIAL | 2.7 V | SPI | 20 µA | 20 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | R-PDSO-N8 | Not Qualified | 85 °C | -40 °C | NOT SPECIFIED | NOT SPECIFIED | 8 | PLASTIC/EPOXY | HVSON | SOLCC8,.25 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 1.27 mm | DUAL | 800 µm | 6 mm | 5 mm | WINBOND ELECTRONICS CORP | WSON-8 | compliant | EAR99 | 8542.32.00.51 | Winbond | ||
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W25Q32FVSTIP
Winbond Electronics Corp
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Check for Price | Yes | Obsolete | 33.5544 Mbit | 1 | 32MX1 | 3 V | 104 MHz | FLASH | 20 | 100000 Write/Erase Cycles | 1 | 32000000 | 33.5544 M | SYNCHRONOUS | SERIAL | 2.7 V | SPI | 20 µA | 20 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | S-PDSO-G8 | Not Qualified | 85 °C | -40 °C | 8 | PLASTIC/EPOXY | VSOP | TSOP8,.3 | SQUARE | SMALL OUTLINE, VERY THIN PROFILE | YES | GULL WING | 1.27 mm | DUAL | 1 mm | 5.28 mm | 5.28 mm | WINBOND ELECTRONICS CORP | 0.208 INCH, GREEN, VSOP-8 | compliant | EAR99 | 8542.32.00.51 | |||||
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W25Q32FVZEIF
Winbond Electronics Corp
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Check for Price | Yes | Obsolete | 33.5544 Mbit | 1 | 32MX1 | 3 V | 104 MHz | FLASH | 20 | 100000 Write/Erase Cycles | 1 | 32000000 | 33.5544 M | SYNCHRONOUS | SERIAL | 2.7 V | SPI | 20 µA | 20 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | R-PDSO-N8 | Not Qualified | 85 °C | -40 °C | 8 | PLASTIC/EPOXY | HVSON | SOLCC8,.3 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 1.27 mm | DUAL | 800 µm | 8 mm | 6 mm | WINBOND ELECTRONICS CORP | HVSON, SOLCC8,.3 | compliant | EAR99 | 8542.32.00.51 | |||||
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W25Q32FVZPIQ
Winbond Electronics Corp
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Check for Price | Yes | Obsolete | 33.5544 Mbit | 1 | 32MX1 | 3 V | 104 MHz | FLASH | 20 | 100000 Write/Erase Cycles | 1 | 32000000 | 33.5544 M | SYNCHRONOUS | SERIAL | 2.7 V | SPI | 20 µA | 20 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | R-PDSO-N8 | Not Qualified | 85 °C | -40 °C | 8 | PLASTIC/EPOXY | HVSON | SOLCC8,.25 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 1.27 mm | DUAL | 800 µm | 6 mm | 5 mm | WINBOND ELECTRONICS CORP | WSON-8 | compliant | EAR99 | 8542.32.00.51 | Winbond | ||||
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W25Q32FVDAIF
Winbond Electronics Corp
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Check for Price | Yes | Obsolete | 33.5544 Mbit | 1 | 32MX1 | 3 V | 104 MHz | FLASH | 20 | 100000 Write/Erase Cycles | 1 | 32000000 | 33.5544 M | SYNCHRONOUS | SERIAL | 2.7 V | SPI | 20 µA | 20 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | R-PDIP-T8 | Not Qualified | 85 °C | -40 °C | 8 | PLASTIC/EPOXY | DIP | DIP8,.3 | RECTANGULAR | IN-LINE | NO | THROUGH-HOLE | 2.54 mm | DUAL | 5.33 mm | 9.27 mm | 7.62 mm | WINBOND ELECTRONICS CORP | DIP, DIP8,.3 | compliant | EAR99 | 8542.32.00.51 | |||||
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W25Q32FVSTIG
Winbond Electronics Corp
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Check for Price | Yes | Obsolete | 33.5544 Mbit | 1 | 32MX1 | 3 V | 104 MHz | FLASH | 20 | 100000 Write/Erase Cycles | 1 | 32000000 | 33.5544 M | SYNCHRONOUS | SERIAL | 2.7 V | SPI | 20 µA | 20 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | S-PDSO-G8 | Not Qualified | 85 °C | -40 °C | 8 | PLASTIC/EPOXY | VSOP | TSOP8,.3 | SQUARE | SMALL OUTLINE, VERY THIN PROFILE | YES | GULL WING | 1.27 mm | DUAL | 1 mm | 5.28 mm | 5.28 mm | WINBOND ELECTRONICS CORP | VSOP-8 | compliant | EAR99 | 8542.32.00.51 | |||||
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W25Q32FVSFIP
Winbond Electronics Corp
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Check for Price | Yes | Obsolete | 33.5544 Mbit | 1 | 32MX1 | 3 V | 104 MHz | FLASH | 20 | 100000 Write/Erase Cycles | 1 | 32000000 | 33.5544 M | SYNCHRONOUS | SERIAL | 2.7 V | SPI | 20 µA | 20 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | R-PDSO-G16 | Not Qualified | 85 °C | -40 °C | 16 | PLASTIC/EPOXY | SOP | SOP16,.4 | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | 2.64 mm | 10.31 mm | 7.49 mm | WINBOND ELECTRONICS CORP | 0.300 INCH, GREEN, SOIC-16 | compliant | EAR99 | 8542.32.00.51 | |||||
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W25Q32FVSFIQ
Winbond Electronics Corp
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Check for Price | Yes | Obsolete | 33.5544 Mbit | 1 | 32MX1 | 3 V | 104 MHz | FLASH | 20 | 100000 Write/Erase Cycles | 1 | 32000000 | 33.5544 M | SYNCHRONOUS | SERIAL | 2.7 V | SPI | 20 µA | 20 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | R-PDSO-G16 | Not Qualified | 85 °C | -40 °C | 16 | PLASTIC/EPOXY | SOP | SOP16,.4 | RECTANGULAR | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | 2.64 mm | 10.31 mm | 7.49 mm | WINBOND ELECTRONICS CORP | SOIC-16 | compliant | EAR99 | 8542.32.00.51 | Winbond | ||||
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W25Q32FVZPIP
Winbond Electronics Corp
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Check for Price | Yes | Obsolete | 33.5544 Mbit | 1 | 32MX1 | 3 V | 104 MHz | FLASH | 20 | 100000 Write/Erase Cycles | 1 | 32000000 | 33.5544 M | SYNCHRONOUS | SERIAL | 2.7 V | SPI | 20 µA | 20 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | R-PDSO-N8 | Not Qualified | 85 °C | -40 °C | 8 | PLASTIC/EPOXY | HVSON | SOLCC8,.25 | RECTANGULAR | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | YES | NO LEAD | 1.27 mm | DUAL | 800 µm | 6 mm | 5 mm | WINBOND ELECTRONICS CORP | 6 X 5 MM, GREEN, WSON-8 | compliant | EAR99 | 8542.32.00.51 | |||||
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W25Q32FVSSIP
Winbond Electronics Corp
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Check for Price | Yes | Obsolete | 33.5544 Mbit | 1 | 32MX1 | 3 V | 104 MHz | FLASH | 20 | 100000 Write/Erase Cycles | 1 | 32000000 | 33.5544 M | SYNCHRONOUS | SERIAL | 2.7 V | SPI | 20 µA | 20 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | HARDWARE/SOFTWARE | S-PDSO-G8 | Not Qualified | 85 °C | -40 °C | 8 | PLASTIC/EPOXY | SOP | SOP8,.3 | SQUARE | SMALL OUTLINE | YES | GULL WING | 1.27 mm | DUAL | 2.16 mm | 5.23 mm | 5.23 mm | WINBOND ELECTRONICS CORP | SOIC-8 | compliant | EAR99 | 8542.32.00.51 | Winbond |