Findchips: Parametric Search Results for bluetooth communications softw

Parametric results for: bluetooth communications ... under Multifunction Peripherals

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1 - 10 of 11 results

uPs/uCs/Peripheral ICs Type: Bluetooth SoC

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Select Parts		Part Number

		CY8C6347FMI-BLD53T Infineon Technologies AG
		CY8C6347FMI-BLD13T Infineon Technologies AG
		CY8C6347FMI-BLD33T Infineon Technologies AG
		CY8C6347FMI-BLD43T Infineon Technologies AG
		CY8C6336BZI-BLF03T Infineon Technologies AG
		CY8C6347BZI-BLD53T Infineon Technologies AG
		CY8C6316BZI-BLF53T Infineon Technologies AG
		CY8C6316BZI-BLF03T Infineon Technologies AG
		CY8C6336BZI-BLD13T Infineon Technologies AG
		CY8C6347BZI-BLD33T Infineon Technologies AG

			Most Relevant		Technical		Compliance		Operating Conditions					Physical										Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	JESD-30 Code	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Operating Temperature-Min	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Reach Compliance Code	Samacsys Manufacturer

$7.0100

Yes

Active

YES

1.1 V

Bluetooth SoC

CMOS

R-PBGA-B104

85 °C

-40 °C

NOT SPECIFIED

104

PLASTIC/EPOXY

VFBGA

BGA104,9X14,14

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

350 µm

BOTTOM

650 µm

3.841 mm

5 mm

INFINEON TECHNOLOGIES AG

compliant

Infineon

$10.3500

Yes

Active

YES

1.1 V

Bluetooth SoC

CMOS

R-PBGA-B104

85 °C

-40 °C

NOT SPECIFIED

104

PLASTIC/EPOXY

VFBGA

BGA104,9X14,14

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

350 µm

BOTTOM

650 µm

3.841 mm

5 mm

INFINEON TECHNOLOGIES AG

compliant

Infineon

$10.7466

Yes

Active

YES

1.1 V

Bluetooth SoC

CMOS

R-PBGA-B104

85 °C

-40 °C

NOT SPECIFIED

104

PLASTIC/EPOXY

VFBGA

BGA104,9X14,14

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

350 µm

BOTTOM

650 µm

3.841 mm

5 mm

INFINEON TECHNOLOGIES AG

compliant

Infineon

$11.0000

Yes

Active

YES

1.1 V

Bluetooth SoC

CMOS

R-PBGA-B104

85 °C

-40 °C

NOT SPECIFIED

104

PLASTIC/EPOXY

VFBGA

BGA104,9X14,14

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

350 µm

BOTTOM

650 µm

3.841 mm

5 mm

INFINEON TECHNOLOGIES AG

compliant

Infineon

Check for Price

Active

YES

1.1 V

Bluetooth SoC

CMOS

R-PBGA-B116

85 °C

-40 °C

116

PLASTIC/EPOXY

BGA

BGA116,10X12,20

RECTANGULAR

GRID ARRAY

BALL

500 µm

BOTTOM

700 µm

5.2 mm

6.4 mm

INFINEON TECHNOLOGIES AG

compliant

Check for Price

Yes

Active

YES

1.1 V

Bluetooth SoC

CMOS

R-PBGA-B116

85 °C

-40 °C

NOT SPECIFIED

116

PLASTIC/EPOXY

BGA

BGA116,10X12,20

RECTANGULAR

GRID ARRAY

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

500 µm

BOTTOM

700 µm

5.2 mm

6.4 mm

INFINEON TECHNOLOGIES AG

compliant

Infineon

Check for Price

Active

YES

1.1 V

Bluetooth SoC

CMOS

R-PBGA-B116

85 °C

-40 °C

116

PLASTIC/EPOXY

BGA

BGA116,10X12,20

RECTANGULAR

GRID ARRAY

BALL

500 µm

BOTTOM

700 µm

5.2 mm

6.4 mm

INFINEON TECHNOLOGIES AG

compliant

Check for Price

Active

YES

1.1 V

Bluetooth SoC

CMOS

R-PBGA-B116

85 °C

-40 °C

116

PLASTIC/EPOXY

BGA

BGA116,10X12,20

RECTANGULAR

GRID ARRAY

BALL

500 µm

BOTTOM

700 µm

5.2 mm

6.4 mm

INFINEON TECHNOLOGIES AG

compliant

Check for Price

Active

YES

1.1 V

Bluetooth SoC

CMOS

R-PBGA-B116

85 °C

-40 °C

116

PLASTIC/EPOXY

BGA

BGA116,10X12,20

RECTANGULAR

GRID ARRAY

BALL

500 µm

BOTTOM

700 µm

5.2 mm

6.4 mm

INFINEON TECHNOLOGIES AG

compliant

Check for Price

Active

YES

1.1 V

Bluetooth SoC

CMOS

R-PBGA-B116

85 °C

-40 °C

116

PLASTIC/EPOXY

BGA

BGA116,10X12,20

RECTANGULAR

GRID ARRAY

BALL

500 µm

BOTTOM

700 µm

5.2 mm

6.4 mm

INFINEON TECHNOLOGIES AG

compliant

1 2 Next

Compare

CY8C6347FMI-BLD53T

Infineon Technologies AG

$7.0100

Yes

Active

YES

1.1 V

Bluetooth SoC

CMOS

R-PBGA-B104

85 °C

-40 °C

NOT SPECIFIED

104

PLASTIC/EPOXY

VFBGA

BGA104,9X14,14

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

350 µm

BOTTOM

650 µm

3.841 mm

5 mm

INFINEON TECHNOLOGIES AG

compliant

Infineon

CY8C6347FMI-BLD13T

Infineon Technologies AG

$10.3500

Yes

Active

YES

1.1 V

Bluetooth SoC

CMOS

R-PBGA-B104

85 °C

-40 °C

NOT SPECIFIED

104

PLASTIC/EPOXY

VFBGA

BGA104,9X14,14

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

350 µm

BOTTOM

650 µm

3.841 mm

5 mm

INFINEON TECHNOLOGIES AG

compliant

Infineon

CY8C6347FMI-BLD33T

Infineon Technologies AG

$10.7466

Yes

Active

YES

1.1 V

Bluetooth SoC

CMOS

R-PBGA-B104

85 °C

-40 °C

NOT SPECIFIED

104

PLASTIC/EPOXY

VFBGA

BGA104,9X14,14

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

350 µm

BOTTOM

650 µm

3.841 mm

5 mm

INFINEON TECHNOLOGIES AG

compliant

Infineon

CY8C6347FMI-BLD43T

Infineon Technologies AG

$11.0000

Yes

Active

YES

1.1 V

Bluetooth SoC

CMOS

R-PBGA-B104

85 °C

-40 °C

NOT SPECIFIED

104

PLASTIC/EPOXY

VFBGA

BGA104,9X14,14

RECTANGULAR

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

350 µm

BOTTOM

650 µm

3.841 mm

5 mm

INFINEON TECHNOLOGIES AG

compliant

Infineon

CY8C6336BZI-BLF03T

Infineon Technologies AG

Check for Price

Active

YES

1.1 V

Bluetooth SoC

CMOS

R-PBGA-B116

85 °C

-40 °C

116

PLASTIC/EPOXY

BGA

BGA116,10X12,20

RECTANGULAR

GRID ARRAY

BALL

500 µm

BOTTOM

700 µm

5.2 mm

6.4 mm

INFINEON TECHNOLOGIES AG

compliant

CY8C6347BZI-BLD53T

Infineon Technologies AG

Check for Price

Yes

Active

YES

1.1 V

Bluetooth SoC

CMOS

R-PBGA-B116

85 °C

-40 °C

NOT SPECIFIED

116

PLASTIC/EPOXY

BGA

BGA116,10X12,20

RECTANGULAR

GRID ARRAY

Tin/Silver/Copper (Sn/Ag/Cu)

BALL

500 µm

BOTTOM

700 µm

5.2 mm

6.4 mm

INFINEON TECHNOLOGIES AG

compliant

Infineon

CY8C6316BZI-BLF53T

Infineon Technologies AG

Check for Price

Active

YES

1.1 V

Bluetooth SoC

CMOS

R-PBGA-B116

85 °C

-40 °C

116

PLASTIC/EPOXY

BGA

BGA116,10X12,20

RECTANGULAR

GRID ARRAY

BALL

500 µm

BOTTOM

700 µm

5.2 mm

6.4 mm

INFINEON TECHNOLOGIES AG

compliant

CY8C6316BZI-BLF03T

Infineon Technologies AG

Check for Price

Active

YES

1.1 V

Bluetooth SoC

CMOS

R-PBGA-B116

85 °C

-40 °C

116

PLASTIC/EPOXY

BGA

BGA116,10X12,20

RECTANGULAR

GRID ARRAY

BALL

500 µm

BOTTOM

700 µm

5.2 mm

6.4 mm

INFINEON TECHNOLOGIES AG

compliant

CY8C6336BZI-BLD13T

Infineon Technologies AG

Check for Price

Active

YES

1.1 V

Bluetooth SoC

CMOS

R-PBGA-B116

85 °C

-40 °C

116

PLASTIC/EPOXY

BGA

BGA116,10X12,20

RECTANGULAR

GRID ARRAY

BALL

500 µm

BOTTOM

700 µm

5.2 mm

6.4 mm

INFINEON TECHNOLOGIES AG

compliant

CY8C6347BZI-BLD33T

Infineon Technologies AG

Check for Price

Active

YES

1.1 V

Bluetooth SoC

CMOS

R-PBGA-B116

85 °C

-40 °C

116

PLASTIC/EPOXY

BGA

BGA116,10X12,20

RECTANGULAR

GRID ARRAY

BALL

500 µm

BOTTOM

700 µm

5.2 mm

6.4 mm

INFINEON TECHNOLOGIES AG

compliant

1 2 Next