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HS01
Apex Microtechnology Inc
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$18.5685 | Active | HEAT SINK | BLACK | U | LONGITUDINAL | ANODIZED | 40.6 mm | 25.4 mm | 25.4 mm | APEX MICROTECHNOLOGY INC | compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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5962F9954701V9A
Renesas Electronics Corporation
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Check for Price | Yes | Active | 15.875 mm | 11.43 mm | RENESAS ELECTRONICS CORP | compliant | , | EAR99 | 8542.39.00.01 | Adjustable,Positive,Single Output,Standard Drop | e4 | 1 | 3 | 125 °C | -55 °C | 5.5 V | 1.5 V | UNSPECIFIED | CHIP CARRIER | Not Qualified | ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR | 3.58 mm | Gold (Au) | BOTTOM | |||||||||||||||||||||||||||||||||||||||||||||||
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HS0-1840BRH-Q
Intersil Corporation
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Check for Price | Yes | Transferred | 125 °C | -55 °C | INTERSIL CORP | compliant | DIE, | 8542.39.00.01 | e4 | 1 | 26 | UNSPECIFIED | UNCASED CHIP | Not Qualified | GOLD | UPPER | DIE | 26 | SINGLE-ENDED MULTIPLEXER | R-XUUC-N26 | -16 V | -15 V | -15.5 V | 16 | DIE | RECTANGULAR | 16 V | 15 V | 15.5 V | YES | CMOS | MILITARY | NO LEAD | ||||||||||||||||||||||||||||||||||||||
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HS1-1840BEH-Q
Intersil Corporation
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Check for Price | Yes | Transferred | 125 °C | -55 °C | 37.85 mm | 15.24 mm | INTERSIL CORP | compliant | DIP, DIP28,.6 | 8542.39.00.01 | e4 | 1 | 28 | CERAMIC, METAL-SEALED COFIRED | IN-LINE | Not Qualified | 5.92 mm | GOLD | DUAL | SINGLE-ENDED MULTIPLEXER | R-CDIP-T28 | -12 V | 16 | DIP | RECTANGULAR | 12 V | NO | BICMOS | MILITARY | THROUGH-HOLE | 3 kΩ | DIP28,.6 | 38535V;38534K;883S | 500 µA | 1.5 µs | BREAK-BEFORE-MAKE | 2.54 mm | 300k Rad(Si) V | |||||||||||||||||||||||||||||||||
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HS-0111
Asahi Kasei Microsystems Corporation
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Check for Price | Active | 110 °C | -40 °C | ASAHI KASEI MICRODEVICES CORP | unknown | YES | 0.8 inch | 450 µm | 1.6 mm | SURFACE MOUNT | 20 mA | 52-67mV | ANALOG VOLTAGE | RECTANGULAR | 335 Ω | MAGNETIC FIELD SENSOR,HALL EFFECT | SOLDER | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
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HS9-1840BEH-Q
Intersil Corporation
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Check for Price | Yes | Transferred | 125 °C | -55 °C | 18.8 mm | 12.445 mm | INTERSIL CORP | compliant | DFP, FL28,.5 | 8542.39.00.01 | e4 | 1 | 28 | CERAMIC, METAL-SEALED COFIRED | FLATPACK | Not Qualified | 2.92 mm | GOLD | DUAL | SINGLE-ENDED MULTIPLEXER | R-CDFP-F28 | -12 V | 16 | DFP | RECTANGULAR | 12 V | YES | BICMOS | MILITARY | FLAT | 3 kΩ | FL28,.5 | 38535V;38534K;883S | 500 µA | 1.5 µs | BREAK-BEFORE-MAKE | 1.27 mm | 300k Rad(Si) V | |||||||||||||||||||||||||||||||||
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5962F9563005V9A
Renesas Electronics Corporation
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Check for Price | Active | 125 °C | -55 °C | RENESAS ELECTRONICS CORP | compliant | DIE, | 8542.39.00.01 | 1 | 26 | UNSPECIFIED | UNCASED CHIP | Not Qualified | UPPER | SINGLE-ENDED MULTIPLEXER | R-XUUC-N26 | 16 | DIE | RECTANGULAR | YES | BICMOS | MILITARY | NO LEAD | MIL-PRF-38535 Class V | 300k Rad(Si) V | |||||||||||||||||||||||||||||||||||||||||||||||
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5962F9563005VYC
Intersil Corporation
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Check for Price | Yes | Transferred | LG-MAX | 125 °C | -55 °C | 18.8 mm | 12.445 mm | INTERSIL CORP | compliant | DFP, FL28,.5 | 8542.39.00.01 | e4 | 1 | 28 | CERAMIC, METAL-SEALED COFIRED | FLATPACK | Not Qualified | 2.92 mm | GOLD | DUAL | SINGLE-ENDED MULTIPLEXER | R-CDFP-F28 | -13.2 V | -10.8 V | -12 V | 16 | DFP | RECTANGULAR | 13.2 V | 10.8 V | 12 V | YES | BICMOS | MILITARY | FLAT | FL28,.5 | MIL-PRF-38535 Class V | 500 µA | BREAK-BEFORE-MAKE | 1.27 mm | 300k Rad(Si) V | ||||||||||||||||||||||||||||||
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HS0-1840AEH-Q
Intersil Corporation
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Check for Price | Yes | Transferred | 125 °C | -55 °C | INTERSIL CORP | compliant | DIE, | 8542.39.00.01 | e4 | 1 | 26 | UNSPECIFIED | UNCASED CHIP | GOLD | UPPER | SINGLE-ENDED MULTIPLEXER | R-XUUC-N26 | 16 | DIE | RECTANGULAR | YES | BICMOS | MILITARY | NO LEAD | 300k Rad(Si) V | ||||||||||||||||||||||||||||||||||||||||||||||
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HS1-1840AEH-Q
Intersil Corporation
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Check for Price | Yes | Transferred | 125 °C | -55 °C | INTERSIL CORP | compliant | DIE, DIP28,.6 | 8542.39.00.01 | e4 | 1 | 26 | UNSPECIFIED | UNCASED CHIP | Not Qualified | GOLD | UPPER | SINGLE-ENDED MULTIPLEXER | R-XUUC-N26 | -15 V | 16 | DIE | RECTANGULAR | 15 V | YES | BICMOS | MILITARY | NO LEAD | 4 kΩ | DIP28,.6 | 38535V;38534K;883S | 500 µA | 1.5 µs | BREAK-BEFORE-MAKE | 2.54 mm | 300k Rad(Si) V |