Findchips: Parametric Search Results for mc68360czq25l


Select Parts		Part Number

		MC68360CZQ25L Freescale Semiconductor
		MC68360CZQ25L NXP Semiconductors

			Most Relevant									Technical														Compliance		Operating Conditions				Physical										Dimensions			Other
Composite Price	Rohs Code	Part Life Cycle Code	RAM (words)	Bus Compatibility	External Data Bus Width	Address Bus Width	Data Transfer Rate-Max	Clock Frequency-Max	Number of I/O Lines	Surface Mount	Supply Voltage-Nom	uPs/uCs/Peripheral ICs Type	Technology	Additional Feature	Boundary Scan	Communication Protocol	Data Encoding/Decoding Method	Low Power Mode	Number of DMA Channels	Number of Serial I/Os	On Chip Data RAM Width	Supply Current-Max	Supply Voltage-Max	Supply Voltage-Min	Temperature Grade	JESD-30 Code	JESD-609 Code	Moisture Sensitivity Level	Operating Temperature-Max	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Number of Terminals	Package Body Material	Package Code	Package Equivalence Code	Package Shape	Package Style	Terminal Finish	Terminal Form	Terminal Pitch	Terminal Position	Seated Height-Max	Width	Length	Ihs Manufacturer	Part Package Code	Package Description	Pin Count	Reach Compliance Code	ECCN Code	HTS Code

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Transferred

2560

68000

10 MBps

25 MHz

YES

3 V

SERIAL IO/COMMUNICATION CONTROLLER, LAN

CMOS

ALSO OPERATES AT 5 V SUPPLY

YES

ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC

NRZ; NRZI; BIPH-MARK(FM1); BIPH-SPACE(FM... more

YES

250 mA

3.3 V

2.7 V

COMMERCIAL

S-PBGA-B357

70 °C

260

357

PLASTIC/EPOXY

BGA

BGA357,19X19,50

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

1.86 mm

25 mm

FREESCALE SEMICONDUCTOR INC

BGA

1.27 MM PITCH, PLASTIC, BGA-357

357

not_compliant

3A991.A.2

8542.31.00.01

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Obsolete

2560

68000

10 MBps

25 MHz

YES

3 V

SERIAL IO/COMMUNICATION CONTROLLER, LAN

CMOS

ALSO OPERATES AT 5 V SUPPLY

YES

ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC

NRZ; NRZI; BIPH-MARK(FM1); BIPH-SPACE(FM... more

YES

250 mA

3.3 V

2.7 V

COMMERCIAL

S-PBGA-B357

70 °C

260

357

PLASTIC/EPOXY

BGA

BGA357,19X19,50

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

1.86 mm

25 mm

NXP SEMICONDUCTORS

1.27 MM PITCH, PLASTIC, BGA-357

unknown

3A991.A.2

8542.31.00.01

Compare

MC68360CZQ25L

Freescale Semiconductor

Check for Price

Transferred

2560

68000

10 MBps

25 MHz

YES

3 V

SERIAL IO/COMMUNICATION CONTROLLER, LAN

CMOS

ALSO OPERATES AT 5 V SUPPLY

YES

ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC

NRZ; NRZI; BIPH-MARK(FM1); BIPH-SPACE(FM... more

YES

250 mA

3.3 V

2.7 V

COMMERCIAL

S-PBGA-B357

70 °C

260

357

PLASTIC/EPOXY

BGA

BGA357,19X19,50

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

1.86 mm

25 mm

FREESCALE SEMICONDUCTOR INC

BGA

1.27 MM PITCH, PLASTIC, BGA-357

357

not_compliant

3A991.A.2

8542.31.00.01

MC68360CZQ25L

NXP Semiconductors

Check for Price

Obsolete

2560

68000

10 MBps

25 MHz

YES

3 V

SERIAL IO/COMMUNICATION CONTROLLER, LAN

CMOS

ALSO OPERATES AT 5 V SUPPLY

YES

ASYNC, BIT; SYNC, BYTE; SYNC, HDLC; SYNC, SDLC; BISYNC

NRZ; NRZI; BIPH-MARK(FM1); BIPH-SPACE(FM... more

YES

250 mA

3.3 V

2.7 V

COMMERCIAL

S-PBGA-B357

70 °C

260

357

PLASTIC/EPOXY

BGA

BGA357,19X19,50

SQUARE

GRID ARRAY

Tin/Lead (Sn/Pb)

BALL

1.27 mm

BOTTOM

1.86 mm

25 mm

NXP SEMICONDUCTORS

1.27 MM PITCH, PLASTIC, BGA-357

unknown

3A991.A.2

8542.31.00.01

Parametric results for: mc68360czq25l under Serial IO/Communication Controllers