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S25FL256SAGBHIC00
Cypress Semiconductor
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Check for Price | Yes | Transferred | 268.4355 Mbit | 8 | 32MX8 | 3 V | 133 MHz | FLASH | ALSO CONFIGURABLE AS 128M X 1 | 2 | 20 | 100000 Write/Erase Cycles | 1 | 32000000 | 33.5544 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | SPI | 100 µA | 100 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | 500 ms | HARDWARE/SOFTWARE | R-PBGA-B24 | Not Qualified | e1 | 85 °C | -40 °C | 24 | PLASTIC/EPOXY | TBGA | BGA24,5X5,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | YES | TIN SILVER COPPER | BALL | 1 mm | BOTTOM | 1.2 mm | 8 mm | 6 mm | CYPRESS SEMICONDUCTOR CORP | compliant | 3A991.B.1.A | 8542.32.00.51 | ||||||||||
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S25FL256SAGBHIC00
Spansion
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Check for Price | Yes | Transferred | 268.4355 Mbit | 8 | 32MX8 | 3 V | 133 MHz | FLASH | ALSO CONFIGURABLE AS 128M X 1 | 2 | 20 | 100000 Write/Erase Cycles | 1 | 32000000 | 33.5544 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | SPI | 100 µA | 100 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | 500 ms | HARDWARE/SOFTWARE | R-PBGA-B24 | Not Qualified | 85 °C | -40 °C | 24 | PLASTIC/EPOXY | TBGA | BGA24,5X5,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | YES | BALL | 1 mm | BOTTOM | 1.2 mm | 8 mm | 6 mm | SPANSION INC | compliant | 3A991.B.1.A | 8542.32.00.51 | BGA | FBGA-24 | 24 | Spansion | ||||||||
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S25FL256SAGBHIC00
Infineon Technologies AG
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Check for Price | Yes | Active | 268.4355 Mbit | 8 | 32MX8 | 3 V | 133 MHz | FLASH | ALSO CONFIGURABLE AS 128M X 1 | 2 | 20 | 100000 Write/Erase Cycles | 1 | 32000000 | 33.5544 M | SYNCHRONOUS | 3-STATE | SERIAL | 3 V | SPI | 100 µA | 100 µA | 3.6 V | 2.7 V | CMOS | INDUSTRIAL | NOR TYPE | 500 ms | HARDWARE/SOFTWARE | R-PBGA-B24 | Not Qualified | e1 | 3 | 85 °C | -40 °C | NOT SPECIFIED | AEC-Q100 | NOT SPECIFIED | 24 | PLASTIC/EPOXY | TBGA | BGA24,5X5,40 | RECTANGULAR | GRID ARRAY, THIN PROFILE | YES | Tin/Silver/Copper (Sn/Ag/Cu) | BALL | 1 mm | BOTTOM | 1.2 mm | 8 mm | 6 mm | INFINEON TECHNOLOGIES AG | compliant | Infineon |