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S71GL032N80BFW0P3
Spansion
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Check for Price | Yes | Obsolete | 33.5544 Mbit | 16 | 2MX16 | 3 V | MEMORY CIRCUIT | PSRAM IS ORGANIZED AS 512K X 16 | 1 | 2000000 | 2.0972 M | ASYNCHRONOUS | 3.1 V | 2.7 V | CMOS | OTHER | R-PBGA-B56 | Not Qualified | e1 | 3 | 85 °C | -25 °C | 260 | 40 | 56 | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.2 mm | 9 mm | 7 mm | SPANSION INC | BGA | 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56 | 56 | unknown | EAR99 | 8542.32.00.71 | |||
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S71GL032N80BFW0P2
Cypress Semiconductor
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Check for Price | Yes | Transferred | 33.5544 Mbit | 16 | 2MX16 | 3 V | MEMORY CIRCUIT | PSRAM IS ORGANIZED AS 512K X 16 | 1 | 2000000 | 2.0972 M | ASYNCHRONOUS | 3.1 V | 2.7 V | CMOS | OTHER | R-PBGA-B56 | Not Qualified | e1 | 3 | 85 °C | -25 °C | 260 | 40 | 56 | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BALL | 800 µm | BOTTOM | 1.2 mm | 9 mm | 7 mm | CYPRESS SEMICONDUCTOR CORP | TFBGA, | compliant | EAR99 | 8542.32.00.71 | |||||
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S71GL032N80BFW0P0
Spansion
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Check for Price | Yes | Obsolete | 33.5544 Mbit | 16 | 2MX16 | 3 V | MEMORY CIRCUIT | PSRAM IS ORGANIZED AS 512K X 16 | 1 | 2000000 | 2.0972 M | ASYNCHRONOUS | 3.1 V | 2.7 V | CMOS | OTHER | R-PBGA-B56 | Not Qualified | e1 | 3 | 85 °C | -25 °C | 260 | 40 | 56 | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.2 mm | 9 mm | 7 mm | SPANSION INC | BGA | 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56 | 56 | unknown | EAR99 | 8542.32.00.71 | |||
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S71GL032N80BFW0P2
Spansion
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Check for Price | Yes | Yes | Transferred | 33.5544 Mbit | 16 | 2MX16 | 3 V | MEMORY CIRCUIT | PSRAM IS ORGANIZED AS 512K X 16 | 1 | 2000000 | 2.0972 M | ASYNCHRONOUS | 3.1 V | 2.7 V | CMOS | OTHER | R-PBGA-B56 | Not Qualified | e1 | 3 | 85 °C | -25 °C | 260 | 40 | 56 | PLASTIC/EPOXY | TFBGA | RECTANGULAR | GRID ARRAY, THIN PROFILE, FINE PITCH | YES | TIN SILVER COPPER | BALL | 800 µm | BOTTOM | 1.2 mm | 9 mm | 7 mm | SPANSION INC | BGA | 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56 | 56 | unknown | EAR99 | 8542.32.00.71 |