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375324B00035G price and stock

375324B00035G Details
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Newark Authorized Distributor

Part # Manufacturer Description Stock Price Price Range Buy
375324B00035G DISTI # 82K9206
Boyd Corporation 375324B00035G Rohs Compliant: Yes |Boyd 375324B00035G Min Qty: 1920 Package Multiple: 1 Date Code: 0 Container: Bulk 375324B00035G Part Details 0
  • 5760 $4.4100
  • 3840 $4.5200
  • 1 $4.6400
$4.4100 / $4.6400 Buy Now 375324B00035G Part Details
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Mouser Electronics ECIA (NEDA) Member • Authorized Distributor

Part # Manufacturer Description Stock Price Price Range Buy
375324B00035G DISTI # 532-375324B00035G
BOYD Laconia Heat Sinks Heat Sink for Plastic BGA Packages, Black, 10.2x10.2x10.2mm, IC=10x10, Tape #35 RoHS: Compliant 375324B00035G Part Details 772
  • 1 $5.0400
  • 25 $4.2000
  • 100 $3.8400
  • 250 $3.7000
  • 500 $3.4800
  • 1000 $2.9800
  • 1920 $2.9400
$2.9400 / $5.0400 Buy Now 375324B00035G Part Details
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RS (Formerly Allied Electronics & Automation)

Part # Manufacturer Description Stock Price Price Range Buy
375324B00035G DISTI # 75020290
Boyd Corporation Extruded Heatsink, 375324B00035G | Boyd 375324B00035G RoHS: Compliant Min Qty: 1920 Package Multiple: 1 Lead time: 6 Weeks, 0 Days Container: Bulk 375324B00035G Part Details 0
  • 1920 $3.5110
$3.5110 RFQ 375324B00035G Part Details
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Future Electronics ECIA (NEDA) Member • Authorized Distributor

Part # Manufacturer Description Stock Price Price Range Buy
375324B00035G
BOYD Laconia Heat Sinks Pin Fin Heat Sink w/Tape Attachment RoHS: Compliant pbFree: Yes Min Qty: 1920 Package Multiple: 192 Container: Tray 375324B00035G Part Details 0
Tray
  • 768 $2.6900
  • 576 $2.7300
  • 384 $2.7600
  • 192 $2.8100
$2.6900 / $2.8100 Buy Now 375324B00035G Part Details
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Onlinecomponents.com ECIA (NEDA) Member • Authorized Distributor

Part # Manufacturer Description Stock Price Price Range Buy
375324B00035G
BOYD Laconia Heat Sink Passive BGA/FPGA Extruded Adhesive Aluminum 71.4°C/W Black Anodized RoHS: Compliant 375324B00035G Part Details 1000 In Stock
  • 1920 $2.9600
  • 1440 $3.0200
  • 960 $3.2000
  • 480 $3.4200
  • 100 $3.6400
  • 50 $4.0300
  • 25 $4.2700
  • 10 $4.9600
$2.9600 / $4.9600 Buy Now 375324B00035G Part Details
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TME ECIA Member • Authorized Distributor

Part # Manufacturer Description Stock Price Price Range Buy
375324B00035G DISTI # 375324B00035G
Boyd Corporation Heatsink: extruded, grilled, BGA,FPGA, black, L: 10.2mm, W: 10.2mm Min Qty: 1920 375324B00035G Part Details 0
  • 1920 $1.8100
$1.8100 RFQ 375324B00035G Part Details
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Master Electronics ECIA (NEDA) Member • Authorized Distributor

Part # Manufacturer Description Stock Price Price Range Buy
375324B00035G
BOYD Laconia Heat Sink Passive BGA/FPGA Extruded Adhesive Aluminum 71.4°C/W Black Anodized RoHS: Compliant 375324B00035G Part Details 1000 In Stock
  • 1920 $2.9600
  • 1440 $3.0200
  • 960 $3.2000
  • 480 $3.4200
  • 100 $3.6400
  • 50 $4.0300
  • 25 $4.2700
  • 10 $4.9600
$2.9600 / $4.9600 Buy Now 375324B00035G Part Details
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Avnet Abacus Authorized Distributor

Part # Manufacturer Description Stock Price Price Range Buy
375324B00035G DISTI # 035731
Boyd Corporation Heat Sink Passive BGA Pin Array Tape Plastic 71.4�C/W Black Anodized (Alt: 035731) RoHS: Compliant Min Qty: 1920 Package Multiple: 1920 Lead time: 2 Weeks, 4 Days 375324B00035G Part Details Abacus - 0   Buy Now 375324B00035G Part Details

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