5962-8685924TA vs KM6465BLP-20 feature comparison

5962-8685924TA Micross Components

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KM6465BLP-20 Samsung Semiconductor

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Part Life Cycle Code Active Obsolete
Ihs Manufacturer MICROSS COMPONENTS SAMSUNG SEMICONDUCTOR INC
Part Package Code DIP DIP
Package Description DIP, DIP, DIP22,.3
Pin Count 22 22
Reach Compliance Code compliant unknown
ECCN Code 3A001.A.2.C EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 35 ns 20 ns
JESD-30 Code R-CDIP-T22 R-PDIP-T22
Length 29.337 mm 26.745 mm
Memory Density 65536 bit 65536 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 4 4
Number of Functions 1 1
Number of Terminals 22 22
Number of Words 16384 words 16384 words
Number of Words Code 16000 16000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Organization 16KX4 16KX4
Package Body Material CERAMIC, METAL-SEALED COFIRED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Screening Level MIL-STD-883 Class C
Seated Height-Max 5.08 mm 5.08 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 1 1
Pbfree Code No
Rohs Code No
I/O Type COMMON
JESD-609 Code e0
Number of Ports 1
Output Characteristics 3-STATE
Output Enable NO
Package Equivalence Code DIP22,.3
Standby Current-Max 0.00005 A
Standby Voltage-Min 2 V
Supply Current-Max 0.12 mA
Terminal Finish TIN LEAD

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