5962-9559511HMX
vs
P4C164L-45DCLF
feature comparison
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
WHITE MICROELECTRONICS
|
PYRAMID SEMICONDUCTOR CORP
|
| Package Description |
22.40 MM, CERAMIC, QFP-68
|
0.300 INCH, ROHS COMPLIANT, CERAMIC, DIP-28
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
3A001.A.2.C
|
EAR99
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
15 ns
|
45 ns
|
| Additional Feature |
USER CONFIGURABLE AS 512K X 8
|
|
| Alternate Memory Width |
16
|
|
| JESD-30 Code |
S-CQFP-G68
|
R-CDIP-T28
|
| Memory Density |
4194304 bit
|
65536 bit
|
| Memory IC Type |
SRAM MODULE
|
STANDARD SRAM
|
| Memory Width |
32
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
68
|
28
|
| Number of Words |
131072 words
|
8192 words
|
| Number of Words Code |
128000
|
8000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
125 °C
|
70 °C
|
| Operating Temperature-Min |
-55 °C
|
|
| Organization |
128KX32
|
8KX8
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
FLATPACK
|
IN-LINE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
|
| Screening Level |
MIL-STD-883
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
COMMERCIAL
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Position |
QUAD
|
DUAL
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
DIP
|
| Pin Count |
|
28
|
| Package Code |
|
DIP
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Seated Height-Max |
|
5.715 mm
|
| Terminal Pitch |
|
2.54 mm
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
| Width |
|
7.62 mm
|
|
|
|
Compare 5962-9559511HMX with alternatives
Compare P4C164L-45DCLF with alternatives