AD7655ACP
vs
5962-8763501RA
feature comparison
| Pbfree Code |
No
|
No
|
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS INC
|
ROCHESTER ELECTRONICS INC
|
| Part Package Code |
QFN
|
DIP
|
| Package Description |
HVQCCN,
|
DIP,
|
| Pin Count |
48
|
20
|
| Reach Compliance Code |
unknown
|
unknown
|
| Analog Input Voltage-Max |
5 V
|
5 V
|
| Analog Input Voltage-Min |
|
3.4 V
|
| Conversion Time-Max |
1.25 µs
|
10 µs
|
| Converter Type |
ADC, SUCCESSIVE APPROXIMATION
|
ADC, SUCCESSIVE APPROXIMATION
|
| JESD-30 Code |
S-XQCC-N48
|
R-CDIP-T20
|
| JESD-609 Code |
e0
|
|
| Length |
7 mm
|
|
| Linearity Error-Max (EL) |
0.0092%
|
|
| Moisture Sensitivity Level |
3
|
NOT SPECIFIED
|
| Number of Analog In Channels |
4
|
2
|
| Number of Bits |
16
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
48
|
20
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Output Bit Code |
BINARY
|
BINARY
|
| Output Format |
SERIAL, PARALLEL, 8 BITS, PARALLEL, WORD
|
PARALLEL, 8 BITS
|
| Package Body Material |
UNSPECIFIED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
HVQCCN
|
DIP
|
| Package Shape |
SQUARE
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
240
|
NOT SPECIFIED
|
| Sample Rate |
1 MHz
|
|
| Sample and Hold / Track and Hold |
SAMPLE
|
|
| Seated Height-Max |
1 mm
|
5.08 mm
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
NOT SPECIFIED
|
| Terminal Form |
NO LEAD
|
THROUGH-HOLE
|
| Terminal Pitch |
0.5 mm
|
2.54 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
| Width |
7 mm
|
7.62 mm
|
| Base Number Matches |
2
|
3
|
| Qualification Status |
|
MILITARY
|
| Technology |
|
BIPOLAR
|
|
|
|
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