AGL600V2-FG256Y
vs
AGLN015V2-QNG68I
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
S-PBGA-B256
|
S-XQCC-N68
|
JESD-609 Code |
e0
|
|
Length |
17 mm
|
8 mm
|
Moisture Sensitivity Level |
3
|
3
|
Number of Equivalent Gates |
600000
|
15000
|
Number of Inputs |
177
|
|
Number of Logic Cells |
13824
|
|
Number of Outputs |
177
|
|
Number of Terminals |
256
|
68
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Organization |
600000 GATES
|
384 CLBS, 15000 GATES
|
Package Body Material |
PLASTIC/EPOXY
|
UNSPECIFIED
|
Package Code |
BGA
|
HVQCCN
|
Package Equivalence Code |
BGA256,16X16,40
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Seated Height-Max |
1.7 mm
|
1 mm
|
Supply Voltage-Max |
1.575 V
|
1.575 V
|
Supply Voltage-Min |
1.14 V
|
1.14 V
|
Supply Voltage-Nom |
1.2 V
|
1.2 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Finish |
Tin/Lead/Silver (Sn/Pb/Ag)
|
|
Terminal Form |
BALL
|
NO LEAD
|
Terminal Pitch |
1 mm
|
0.4 mm
|
Terminal Position |
BOTTOM
|
QUAD
|
Width |
17 mm
|
8 mm
|
Base Number Matches |
4
|
1
|
Package Description |
|
8 X 8 MM, 0.90 MM HEIGHT, 0.40 MM PITCH, ROHS COMPLIANT, QFN-68
|
Factory Lead Time |
|
8 Weeks
|
Number of CLBs |
|
384
|
Qualification Status |
|
Not Qualified
|
Temperature Grade |
|
INDUSTRIAL
|
|
|
|
Compare AGL600V2-FG256Y with alternatives
Compare AGLN015V2-QNG68I with alternatives