BSO301SPHXUMA1
vs
HAT1055R
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
INFINEON TECHNOLOGIES AG
|
RENESAS ELECTRONICS CORP
|
| Part Package Code |
SOT
|
SOT
|
| Package Description |
SMALL OUTLINE, R-PDSO-G5
|
SMALL OUTLINE, R-PDSO-G8
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Factory Lead Time |
20 Weeks
|
|
| Samacsys Manufacturer |
Infineon
|
|
| Additional Feature |
AVALANCHE RATED, LOGIC LEVEL COMPATIBLE
|
AVALANCHE RATED
|
| Avalanche Energy Rating (Eas) |
248 mJ
|
|
| Configuration |
SINGLE WITH BUILT-IN DIODE
|
SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE
|
| DS Breakdown Voltage-Min |
30 V
|
60 V
|
| Drain Current-Max (ID) |
12.6 A
|
5 A
|
| Drain-source On Resistance-Max |
0.008 Ω
|
0.13 Ω
|
| FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
METAL-OXIDE SEMICONDUCTOR
|
| JESD-30 Code |
R-PDSO-G5
|
R-PDSO-G8
|
| JESD-609 Code |
e3
|
|
| Moisture Sensitivity Level |
3
|
|
| Number of Elements |
1
|
2
|
| Number of Terminals |
5
|
8
|
| Operating Mode |
ENHANCEMENT MODE
|
ENHANCEMENT MODE
|
| Operating Temperature-Max |
150 °C
|
150 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Polarity/Channel Type |
P-CHANNEL
|
P-CHANNEL
|
| Pulsed Drain Current-Max (IDM) |
60 A
|
40 A
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
Tin (Sn)
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Transistor Element Material |
SILICON
|
SILICON
|
| Base Number Matches |
1
|
3
|
| Power Dissipation-Max (Abs) |
|
3 W
|
| Transistor Application |
|
SWITCHING
|
|
|
|
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