BU9847GUL-WE2 vs DS2433X-Z01 feature comparison

BU9847GUL-WE2 ROHM Semiconductor

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DS2433X-Z01 Dallas Semiconductor

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer ROHM CO LTD DALLAS SEMICONDUCTOR
Part Package Code BGA
Package Description ROHS COMPLIANT, VCSP-6 FCP-6
Pin Count 6
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.32.00.51
Clock Frequency-Max (fCLK) 0.4 MHz
Data Retention Time-Min 40
Endurance 1000000 Write/Erase Cycles
I2C Control Byte 1010D0MR
JESD-30 Code R-PBGA-B6 R-PBGA-B6
Length 1.95 mm
Memory Density 4096 bit 4096 bit
Memory IC Type EEPROM EEPROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 6 6
Number of Words 512 words 512 words
Number of Words Code 512 512
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 512X8 512X8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VFBGA
Package Equivalence Code BGA6,2X3,20
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY
Parallel/Serial SERIAL SERIAL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.55 mm
Serial Bus Type I2C 1-WIRE
Standby Current-Max 0.000002 A
Supply Current-Max 0.002 mA
Supply Voltage-Max (Vsup) 5.5 V 6 V
Supply Voltage-Min (Vsup) 1.7 V 2.8 V
Supply Voltage-Nom (Vsup) 2.5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 0.5 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 1.06 mm
Write Cycle Time-Max (tWC) 5 ms
Write Protection HARDWARE
Base Number Matches 1 2

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