EDI81256P45FB
vs
SMDP-65697V-45/883:D
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
ELECTRONIC DESIGNS INC
|
TEMIC SEMICONDUCTORS
|
| Reach Compliance Code |
unknown
|
unknown
|
| Access Time-Max |
45 ns
|
45 ns
|
| I/O Type |
SEPARATE
|
|
| JESD-30 Code |
R-CDFP-F28
|
S-CQFP-F28
|
| JESD-609 Code |
e0
|
|
| Memory Density |
262144 bit
|
262144 bit
|
| Memory IC Type |
STANDARD SRAM
|
STANDARD SRAM
|
| Memory Width |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Ports |
1
|
1
|
| Number of Terminals |
28
|
28
|
| Number of Words |
262144 words
|
262144 words
|
| Number of Words Code |
256000
|
256000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Organization |
256KX1
|
256KX1
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Enable |
NO
|
NO
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DFP
|
|
| Package Equivalence Code |
FL28,.4
|
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
FLATPACK
|
FLATPACK
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Screening Level |
38535Q/M;38534H;883B
|
|
| Standby Current-Max |
0.0015 A
|
|
| Standby Voltage-Min |
4.5 V
|
2 V
|
| Supply Current-Max |
0.12 mA
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
FLAT
|
FLAT
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
DUAL
|
QUAD
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare EDI81256P45FB with alternatives
Compare SMDP-65697V-45/883:D with alternatives