EPM7512AEFC256-10 vs ATF1532AE-7CTC256 feature comparison

EPM7512AEFC256-10 Intel Corporation

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ATF1532AE-7CTC256 Atmel Corporation

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer INTEL CORP ATMEL CORP
Package Description FINE LINE, BGA-256 BGA, BGA256,16X16,40
Reach Compliance Code not_compliant compliant
ECCN Code 3A991.D 3A991.D
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Intel
Additional Feature 512 MACROCELLS; 32 LABS; CONFIGURABLE I/O OPERATION WITH 2.5 OR 3.3 YES
Clock Frequency-Max 87 MHz 133 MHz
In-System Programmable YES YES
JESD-30 Code S-PBGA-B256 S-PBGA-B256
JESD-609 Code e0 e0
JTAG BST YES YES
Length 17 mm
Moisture Sensitivity Level 3
Number of Dedicated Inputs
Number of I/O Lines 212 206
Number of Macro Cells 512 512
Number of Terminals 256 256
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 0 DEDICATED INPUTS, 212 I/O 0 DEDICATED INPUTS, 206 I/O
Output Function MACROCELL MACROCELL
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA256,16X16,40 BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Peak Reflow Temperature (Cel) 220
Programmable Logic Type EE PLD EE PLD
Propagation Delay 10 ns 7.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.1 mm
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 20
Width 17 mm
Base Number Matches 2 1
Part Package Code BGA
Pin Count 256

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