Part Details for EPM7512AEFC256-10 by Intel Corporation
Overview of EPM7512AEFC256-10 by Intel Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (1 cross)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Industrial Automation
Financial Technology (Fintech)
Computing and Data Storage
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Aerospace and Defense
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Communication and Networking
Automotive
Part Details for EPM7512AEFC256-10
EPM7512AEFC256-10 CAD Models
EPM7512AEFC256-10 Part Data Attributes:
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EPM7512AEFC256-10
Intel Corporation
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Datasheet
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EPM7512AEFC256-10
Intel Corporation
EE PLD, 10ns, 512-Cell, CMOS, PBGA256, FINE LINE, BGA-256
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | INTEL CORP | |
Package Description | FINE LINE, BGA-256 | |
Reach Compliance Code | not_compliant | |
ECCN Code | 3A991.D | |
HTS Code | 8542.39.00.01 | |
Samacsys Manufacturer | Intel | |
Additional Feature | 512 MACROCELLS; 32 LABS; CONFIGURABLE I/O OPERATION WITH 2.5 OR 3.3 | |
Clock Frequency-Max | 87 MHz | |
In-System Programmable | YES | |
JESD-30 Code | S-PBGA-B256 | |
JESD-609 Code | e0 | |
JTAG BST | YES | |
Length | 17 mm | |
Moisture Sensitivity Level | 3 | |
Number of Dedicated Inputs | ||
Number of I/O Lines | 212 | |
Number of Macro Cells | 512 | |
Number of Terminals | 256 | |
Operating Temperature-Max | 70 °C | |
Operating Temperature-Min | ||
Organization | 0 DEDICATED INPUTS, 212 I/O | |
Output Function | MACROCELL | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | BGA | |
Package Equivalence Code | BGA256,16X16,40 | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Peak Reflow Temperature (Cel) | 220 | |
Programmable Logic Type | EE PLD | |
Propagation Delay | 10 ns | |
Qualification Status | Not Qualified | |
Seated Height-Max | 2.1 mm | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 3 V | |
Supply Voltage-Nom | 3.3 V | |
Surface Mount | YES | |
Technology | CMOS | |
Temperature Grade | COMMERCIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | BALL | |
Terminal Pitch | 1 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 20 | |
Width | 17 mm |
Alternate Parts for EPM7512AEFC256-10
This table gives cross-reference parts and alternative options found for EPM7512AEFC256-10. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of EPM7512AEFC256-10, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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EPM7512AEFC256-10 | EE PLD, 10ns, 512-Cell, CMOS, PBGA256, FINE LINE, BGA-256 | Altera Corporation | EPM7512AEFC256-10 vs EPM7512AEFC256-10 |