Datasheets
EPM7512AEFC256-10 by:

EE PLD, 10ns, 512-Cell, CMOS, PBGA256, FINE LINE, BGA-256

Part Details for EPM7512AEFC256-10 by Intel Corporation

Overview of EPM7512AEFC256-10 by Intel Corporation

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Applications Consumer Electronics Internet of Things (IoT) Industrial Automation Financial Technology (Fintech) Computing and Data Storage Smart Cities Aerospace and Defense Telecommunications Communication and Networking Automotive

Part Details for EPM7512AEFC256-10

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EPM7512AEFC256-10 Part Data Attributes:

EPM7512AEFC256-10 Intel Corporation
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EPM7512AEFC256-10 Intel Corporation EE PLD, 10ns, 512-Cell, CMOS, PBGA256, FINE LINE, BGA-256
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer INTEL CORP
Package Description FINE LINE, BGA-256
Reach Compliance Code not_compliant
ECCN Code 3A991.D
HTS Code 8542.39.00.01
Samacsys Manufacturer Intel
Additional Feature 512 MACROCELLS; 32 LABS; CONFIGURABLE I/O OPERATION WITH 2.5 OR 3.3
Clock Frequency-Max 87 MHz
In-System Programmable YES
JESD-30 Code S-PBGA-B256
JESD-609 Code e0
JTAG BST YES
Length 17 mm
Moisture Sensitivity Level 3
Number of Dedicated Inputs
Number of I/O Lines 212
Number of Macro Cells 512
Number of Terminals 256
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 0 DEDICATED INPUTS, 212 I/O
Output Function MACROCELL
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA256,16X16,40
Package Shape SQUARE
Package Style GRID ARRAY
Peak Reflow Temperature (Cel) 220
Programmable Logic Type EE PLD
Propagation Delay 10 ns
Qualification Status Not Qualified
Seated Height-Max 2.1 mm
Supply Voltage-Max 3.6 V
Supply Voltage-Min 3 V
Supply Voltage-Nom 3.3 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 20
Width 17 mm

Alternate Parts for EPM7512AEFC256-10

This table gives cross-reference parts and alternative options found for EPM7512AEFC256-10. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of EPM7512AEFC256-10, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
EPM7512AEFC256-10 EE PLD, 10ns, 512-Cell, CMOS, PBGA256, FINE LINE, BGA-256 Altera Corporation EPM7512AEFC256-10 vs EPM7512AEFC256-10
Part Number Description Manufacturer Compare
EPM3512AFC256-10N EE PLD, 10ns, 512-Cell, CMOS, PBGA256, FINE LINE, BGA-256 Altera Corporation EPM7512AEFC256-10 vs EPM3512AFC256-10N
EPM7512AEFI256-10 EE PLD, 10ns, 512-Cell, CMOS, PBGA256, FINE LINE, BGA-256 Intel Corporation EPM7512AEFC256-10 vs EPM7512AEFI256-10
ATF1532AE-10CTC256 EE PLD, 10ns, 512-Cell, CMOS, PBGA256, 1 MM PITCH, TBGA-256 Atmel Corporation EPM7512AEFC256-10 vs ATF1532AE-10CTC256
EPM7512AEFI256-10 EE PLD, 10ns, 512-Cell, CMOS, PBGA256, FINE LINE, BGA-256 Altera Corporation EPM7512AEFC256-10 vs EPM7512AEFI256-10
EPM7512AEFC256-7 EE PLD, 7.5ns, 512-Cell, CMOS, PBGA256, FINE LINE, BGA-256 Altera Corporation EPM7512AEFC256-10 vs EPM7512AEFC256-7
ISPLSI5512VE-100LF256I EE PLD, 10ns, 512-Cell, CMOS, PBGA256, THERMALLY ENHANCED, FBGA-256 Lattice Semiconductor Corporation EPM7512AEFC256-10 vs ISPLSI5512VE-100LF256I
EPM3512AFC256-10 EE PLD, 10ns, 512-Cell, CMOS, PBGA256, FINE LINE, BGA-256 Altera Corporation EPM7512AEFC256-10 vs EPM3512AFC256-10
EPM7512AEFC256-7 EE PLD, 7.5ns, 512-Cell, CMOS, PBGA256, FINE LINE, BGA-256 Intel Corporation EPM7512AEFC256-10 vs EPM7512AEFC256-7
EPM7512AEFC256-12 EE PLD, 12ns, 512-Cell, CMOS, PBGA256, FINE LINE, BGA-256 Intel Corporation EPM7512AEFC256-10 vs EPM7512AEFC256-12
ATF1532AE-7CTC256 EE PLD, 7.5ns, 512-Cell, CMOS, PBGA256, 1 MM PITCH, TBGA-256 Atmel Corporation EPM7512AEFC256-10 vs ATF1532AE-7CTC256

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