F475R06W1E3BOMA1
vs
APTCV60TLM45T3G
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
INFINEON TECHNOLOGIES AG
|
MICROSEMI CORP
|
| Package Description |
FLANGE MOUNT, R-XUFM-X11
|
ROHS COMPLIANT PACKAGE-32
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Factory Lead Time |
18 Weeks, 3 Days
|
|
| Samacsys Manufacturer |
Infineon
|
|
| Case Connection |
ISOLATED
|
ISOLATED
|
| Collector Current-Max (IC) |
100 A
|
100 A
|
| Collector-Emitter Voltage-Max |
600 V
|
600 V
|
| Configuration |
COMPLEX
|
COMPLEX
|
| JESD-30 Code |
R-XUFM-X11
|
R-XUFM-X32
|
| Number of Elements |
4
|
4
|
| Number of Terminals |
11
|
32
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLANGE MOUNT
|
FLANGE MOUNT
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Polarity/Channel Type |
N-CHANNEL
|
N-CHANNEL
|
| Surface Mount |
NO
|
NO
|
| Terminal Form |
UNSPECIFIED
|
UNSPECIFIED
|
| Terminal Position |
UPPER
|
UPPER
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Transistor Application |
POWER CONTROL
|
POWER CONTROL
|
| Transistor Element Material |
SILICON
|
SILICON
|
| Turn-off Time-Nom (toff) |
330 ns
|
310 ns
|
| Turn-on Time-Nom (ton) |
45 ns
|
170 ns
|
| Base Number Matches |
1
|
1
|
| Pin Count |
|
32
|
| Gate-Emitter Voltage-Max |
|
20 V
|
| Operating Temperature-Max |
|
175 °C
|
| Power Dissipation-Max (Abs) |
|
250 W
|
| Qualification Status |
|
Not Qualified
|
| VCEsat-Max |
|
1.9 V
|
|
|
|
Compare F475R06W1E3BOMA1 with alternatives
Compare APTCV60TLM45T3G with alternatives