HC5515CM
vs
HC5515IP
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
HARRIS SEMICONDUCTOR
|
HARRIS SEMICONDUCTOR
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Battery Feed |
CONSTANT CURRENT/RESISTIVE
|
CONSTANT CURRENT/RESISTIVE
|
Battery Supply |
-24 TO -58 V
|
-24 TO -58 V
|
Hybrid |
2-4 CONVERSION
|
2-4 CONVERSION
|
JESD-30 Code |
S-PQCC-J28
|
R-PDIP-T22
|
JESD-609 Code |
e0
|
e0
|
Neg Supply Voltage-Nom |
-5 V
|
-5 V
|
Number of Functions |
1
|
1
|
Number of Terminals |
28
|
22
|
Operating Temperature-Max |
70 °C
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QCCJ
|
DIP
|
Package Equivalence Code |
LDCC28,.5SQ
|
DIP22,.4
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
CHIP CARRIER
|
IN-LINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Current-Max |
9.5 mA
|
9.5 mA
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
NO
|
Technology |
BIPOLAR
|
BIPOLAR
|
Telecom IC Type |
SLIC
|
SLIC
|
Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
TIN LEAD
|
Terminal Form |
J BEND
|
THROUGH-HOLE
|
Terminal Pitch |
1.27 mm
|
2.54 mm
|
Terminal Position |
QUAD
|
DUAL
|
Base Number Matches |
2
|
1
|
Package Description |
|
DIP-22
|
|
|
|
Compare HC5515CM with alternatives
Compare HC5515IP with alternatives