HD74HC4066RP
vs
CD4052BFMS
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
HARRIS SEMICONDUCTOR
|
| Part Package Code |
SOIC
|
|
| Package Description |
SOP,
|
,
|
| Pin Count |
14
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
SPST
|
DIFFERENTIAL MULTIPLEXER
|
| JESD-30 Code |
R-PDSO-G14
|
R-GDIP-T16
|
| Length |
8.65 mm
|
|
| Number of Channels |
1
|
4
|
| Number of Functions |
4
|
1
|
| Number of Terminals |
14
|
16
|
| Off-state Isolation-Nom |
50 dB
|
|
| On-state Resistance Match-Nom |
3 Ω
|
|
| On-state Resistance-Max (Ron) |
200 Ω
|
320 Ω
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
SOP
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
|
| Supply Voltage-Max (Vsup) |
6 V
|
|
| Supply Voltage-Min (Vsup) |
2 V
|
|
| Supply Voltage-Nom (Vsup) |
4.5 V
|
15 V
|
| Surface Mount |
YES
|
NO
|
| Switch-off Time-Max |
23 ns
|
608 ns
|
| Switch-on Time-Max |
23 ns
|
972 ns
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
3.9 mm
|
|
| Base Number Matches |
3
|
3
|
| Neg Supply Voltage-Nom (Vsup) |
|
|
| Supply Current-Max (Isup) |
|
0.025 mA
|
| Technology |
|
CMOS
|
|
|
|
Compare HD74HC4066RP with alternatives
Compare CD4052BFMS with alternatives