HEF4069UBTT,112 vs BU4069UBFV-T2 feature comparison

HEF4069UBTT,112 NXP Semiconductors

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BU4069UBFV-T2 ROHM Semiconductor

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer NXP SEMICONDUCTORS ROHM CO LTD
Part Package Code TSSOP SSOP
Package Description 4.40 MM, PLASTIC, MO-153, SOT402-1, TSSOP-14 LSSOP,
Pin Count 14 14
Manufacturer Package Code SOT402-1
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e4 e2
Length 5 mm 5 mm
Load Capacitance (CL) 50 pF
Logic IC Type INVERTER INVERTER
Moisture Sensitivity Level 1
Number of Functions 6 6
Number of Inputs 1 1
Number of Terminals 14 14
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP LSSOP
Package Equivalence Code TSSOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
Packing Method TUBE
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 90 ns
Propagation Delay (tpd) 90 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO
Seated Height-Max 1.1 mm 1.35 mm
Supply Voltage-Max (Vsup) 15 V 16 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) TIN COPPER
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 4.4 mm 4.4 mm
Base Number Matches 1 1
Pbfree Code Yes

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