IAM-91563-BLK
vs
UPC8112TB-E3-A
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
HEWLETT PACKARD CO
|
RENESAS ELECTRONICS CORP
|
| Part Package Code |
SOT-363
|
SOIC
|
| Package Description |
VSSOP,
|
PLASTIC, SMT-6
|
| Pin Count |
6
|
6
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
R-PDSO-G6
|
R-PDSO-G6
|
| JESD-609 Code |
e0
|
e6
|
| Length |
2 mm
|
2 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
6
|
6
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VSSOP
|
TSSOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1 mm
|
1.1 mm
|
| Supply Voltage-Nom |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
RF AND BASEBAND CIRCUIT
|
RF AND BASEBAND CIRCUIT
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN BISMUTH
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
1.25 mm
|
1.25 mm
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Factory Lead Time |
|
4 Weeks
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Technology |
|
BIPOLAR
|
| Temperature Grade |
|
INDUSTRIAL
|
|
|
|
Compare IAM-91563-BLK with alternatives
Compare UPC8112TB-E3-A with alternatives