IS66WV51216BLL-55TLI vs K6F8016U3A-TF700 feature comparison

IS66WV51216BLL-55TLI Integrated Silicon Solution Inc

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K6F8016U3A-TF700 Samsung Semiconductor

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Active Obsolete
Ihs Manufacturer INTEGRATED SILICON SOLUTION INC SAMSUNG SEMICONDUCTOR INC
Part Package Code TSOP2 TSOP2
Package Description LEAD FREE, TSOP2-32 TSOP2,
Pin Count 32 44
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 55 ns 70 ns
I/O Type COMMON
JESD-30 Code R-PDSO-G32 R-PDSO-G44
JESD-609 Code e3
Length 20.95 mm 18.41 mm
Memory Density 8388608 bit 8388608 bit
Memory IC Type PSEUDO STATIC RAM STANDARD SRAM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 32 44
Number of Words 524288 words 524288 words
Number of Words Code 512000 512000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 512KX16 512KX16
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSOP2 TSOP2
Package Equivalence Code TSOP44,.46,32
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Standby Current-Max 0.00013 A
Supply Current-Max 0.028 mA
Supply Voltage-Max (Vsup) 3.6 V 3.3 V
Supply Voltage-Min (Vsup) 2.5 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 0.8 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 10
Width 10.16 mm 10.16 mm
Base Number Matches 1 1

Compare IS66WV51216BLL-55TLI with alternatives

Compare K6F8016U3A-TF700 with alternatives