ISL54224IRUZ-T
vs
ISL54224IRTZ-T
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
RENESAS ELECTRONICS CORP
|
| Part Package Code |
uTQFN
|
TDFN
|
| Package Description |
VQCCN,
|
HVSON,
|
| Pin Count |
10
|
10
|
| Manufacturer Package Code |
L10.1.8X1.4A
|
L10.3X3A
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Date Of Intro |
2017-10-16
|
2017-10-16
|
| Samacsys Manufacturer |
Renesas Electronics
|
Renesas Electronics
|
| Analog IC - Other Type |
SPDT
|
SPDT
|
| JESD-30 Code |
R-PQCC-N10
|
S-PDSO-N10
|
| JESD-609 Code |
e4
|
e3
|
| Length |
1.8 mm
|
3 mm
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Channels |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
10
|
10
|
| Off-state Isolation-Nom |
30 dB
|
30 dB
|
| On-state Resistance Match-Nom |
0.2 Ω
|
0.2 Ω
|
| On-state Resistance-Max (Ron) |
7 Ω
|
7 Ω
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VQCCN
|
HVSON
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
CHIP CARRIER, VERY THIN PROFILE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Seated Height-Max |
0.55 mm
|
0.85 mm
|
| Supply Voltage-Max (Vsup) |
5.25 V
|
5.25 V
|
| Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
Matte Tin (Sn) - annealed
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.4 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
1.4 mm
|
3 mm
|
| Base Number Matches |
2
|
1
|
|
|
|
Compare ISL54224IRUZ-T with alternatives
Compare ISL54224IRTZ-T with alternatives