LM3361AM vs S1T3361D01-D0B0 feature comparison

LM3361AM Texas Instruments

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S1T3361D01-D0B0 Samsung Semiconductor

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NATIONAL SEMICONDUCTOR CORP SAMSUNG SEMICONDUCTOR INC
Part Package Code SOIC DIP
Package Description SOP, SOP16,.25 0.300 INCH, DIP-16
Pin Count 16 16
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Consumer IC Type AUDIO SINGLE CHIP RECEIVER AUDIO DEMODULATOR
Demodulation Type FM FM
JESD-30 Code R-PDSO-G16 R-PDIP-T16
JESD-609 Code e0
Length 9.9 mm 19.4 mm
Number of Terminals 16 16
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min -20 °C
Output Voltage-Nom (FM) 350 mV 150 mV
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP DIP
Package Equivalence Code SOP16,.25 DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 5.08 mm
Supply Current-Max 6 mA 8 mA
Supply Voltage-Max (Vsup) 9 V 7 V
Supply Voltage-Min (Vsup) 2 V 2.5 V
Surface Mount YES NO
Technology BIPOLAR BIPOLAR
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Width 3.9 mm 7.62 mm
Base Number Matches 2 1
Number of Functions 1

Compare LM3361AM with alternatives

Compare S1T3361D01-D0B0 with alternatives