MAX24310EXG+
vs
MAX24310EXG+
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI CORP
|
| Package Description |
10 X 10 MM, ROHS COMPLIANT, CSBGA-81
|
10 X 10 MM, ROHS COMPLIANT, CSBGA-81
|
| Reach Compliance Code |
compliant
|
compliant
|
| Base Number Matches |
2
|
2
|
| Part Package Code |
|
BGA
|
| Pin Count |
|
81
|
| HTS Code |
|
8542.39.00.01
|
| JESD-30 Code |
|
S-PBGA-B81
|
| Length |
|
10 mm
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
81
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
LBGA
|
| Package Shape |
|
SQUARE
|
| Package Style |
|
GRID ARRAY, LOW PROFILE
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Seated Height-Max |
|
1.47 mm
|
| Supply Voltage-Nom |
|
1.8 V
|
| Surface Mount |
|
YES
|
| Telecom IC Type |
|
ATM/SONET/SDH SUPPORT CIRCUIT
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Form |
|
BALL
|
| Terminal Pitch |
|
1 mm
|
| Terminal Position |
|
BOTTOM
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Width |
|
10 mm
|
|
|
|
Compare MAX24310EXG+ with alternatives
Compare MAX24310EXG+ with alternatives