MC9S08AW60CFGE vs MC9S08AW60VFGE feature comparison

MC9S08AW60CFGE NXP Semiconductors

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MC9S08AW60VFGE NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description 10 X 10 MM, 1.40 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, PLASTIC, MS-026BCB, LQFP-44
Reach Compliance Code compliant compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 13 Weeks 13 Weeks
Samacsys Manufacturer NXP NXP
Has ADC YES YES
Address Bus Width
Bit Size 8 8
Clock Frequency-Max 40 MHz 16 MHz
DAC Channels NO
DMA Channels NO YES
External Data Bus Width
JESD-30 Code S-PQFP-G44 S-PQFP-G44
JESD-609 Code e3 e3
Length 10 mm 10 mm
Moisture Sensitivity Level 3 3
Number of I/O Lines 54 34
Number of Terminals 44 44
On Chip Program ROM Width 8
Operating Temperature-Max 85 °C 105 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP QFP
Package Equivalence Code QFP44,.47SQ,32 QFP44,.47SQ,32
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE FLATPACK
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
RAM (bytes) 2048 2048
ROM (words) 63280 63280
ROM Programmability FLASH FLASH
Seated Height-Max 1.6 mm
Speed 40 MHz 40 MHz
Supply Voltage-Max 5.5 V 5.5 V
Supply Voltage-Min 3 V 2.7 V
Supply Voltage-Nom 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin (Sn) Tin (Sn)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 40 40
Width 10 mm 10 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 2 1
CPU Family HCS08
Supply Current-Max 18.5 mA

Compare MC9S08AW60CFGE with alternatives

Compare MC9S08AW60VFGE with alternatives