MC9S12XDT256MAA vs MC9S12XDT256MAL feature comparison

MC9S12XDT256MAA NXP Semiconductors

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MC9S12XDT256MAL NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description LEAD FREE, PLASTIC, QFP-80 LEAD FREE, LQFP-112
Reach Compliance Code compliant compliant
ECCN Code 3A991.A.2 3A991.A.2
HTS Code 8542.31.00.01 8542.31.00.01
Factory Lead Time 13 Weeks 13 Weeks
Samacsys Manufacturer NXP NXP
Has ADC YES YES
Additional Feature IT ALSO REQUIRES 5 V SUPPLY IT ALSO REQUIRES 5 V SUPPLY
Address Bus Width
Bit Size 16 16
CPU Family CPU12 CPU12
Clock Frequency-Max 80 MHz 80 MHz
DAC Channels NO NO
DMA Channels YES YES
External Data Bus Width
JESD-30 Code S-PQFP-G80 S-PQFP-G112
JESD-609 Code e3 e3
Length 14 mm 20 mm
Moisture Sensitivity Level 3 3
Number of I/O Lines 59 91
Number of Terminals 80 112
On Chip Program ROM Width 8 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code QFP LQFP
Package Equivalence Code QFP80,.68SQ QFP112,.87SQ
Package Shape SQUARE SQUARE
Package Style FLATPACK FLATPACK, LOW PROFILE
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
RAM (bytes) 4096 4096
ROM (words) 262144 262144
ROM Programmability FLASH FLASH
Seated Height-Max 2.45 mm 1.6 mm
Speed 40 MHz 40 MHz
Supply Voltage-Max 2.75 V 2.75 V
Supply Voltage-Min 2.35 V 2.35 V
Supply Voltage-Nom 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Tin (Sn) Tin (Sn)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 40 40
Width 14 mm 20 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 2 2

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