MCP633-E/CHY
vs
TSV912IYDT
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
STMICROELECTRONICS
|
| Part Package Code |
SOT-23
|
SOIC
|
| Package Description |
LSSOP,
|
ROHS COMPLIANT, SOP-8
|
| Pin Count |
6
|
8
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Average Bias Current-Max (IIB) |
0.005 µA
|
0.000001 µA
|
| Common-mode Reject Ratio-Nom |
78 dB
|
75 dB
|
| Input Offset Voltage-Max |
8000 µV
|
7500 µV
|
| JESD-30 Code |
R-PDSO-G6
|
R-PDSO-G8
|
| Length |
2.9 mm
|
4.9 mm
|
| Number of Functions |
1
|
2
|
| Number of Terminals |
6
|
8
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LSSOP
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
|
SMALL OUTLINE
|
| Seated Height-Max |
1.45 mm
|
1.75 mm
|
| Slew Rate-Nom |
10 V/us
|
4.5 V/us
|
| Supply Voltage Limit-Max |
6.5 V
|
6 V
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
BICMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.95 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Unity Gain BW-Nom |
24000
|
8000
|
| Width |
1.55 mm
|
3.9 mm
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
Yes
|
| Factory Lead Time |
|
16 Weeks, 3 Days
|
| Samacsys Manufacturer |
|
STMicroelectronics
|
| Architecture |
|
VOLTAGE-FEEDBACK
|
| Bias Current-Max (IIB) @25C |
|
0.00001 µA
|
| Common-mode Reject Ratio-Min |
|
55 dB
|
| Frequency Compensation |
|
YES
|
| Input Offset Current-Max (IIO) |
|
0.0001 µA
|
| JESD-609 Code |
|
e3
|
| Low-Bias |
|
YES
|
| Low-Offset |
|
NO
|
| Micropower |
|
NO
|
| Moisture Sensitivity Level |
|
1
|
| Package Equivalence Code |
|
SOP8,.25
|
| Packing Method |
|
TAPE AND REEL
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Power |
|
NO
|
| Programmable Power |
|
NO
|
| Qualification Status |
|
Not Qualified
|
| Supply Current-Max |
|
2.2 mA
|
| Terminal Finish |
|
Matte Tin (Sn) - annealed
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
| Voltage Gain-Min |
|
5623
|
| Wideband |
|
NO
|
|
|
|
Compare MCP633-E/CHY with alternatives
Compare TSV912IYDT with alternatives