MIC2547-1YTS-TR
vs
MIC2547-2YTS-TR
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
TSSOP-16
|
TSSOP-16
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
9 Weeks
|
8 Weeks
|
Built-in Protections |
OVER CURRENT; THERMAL
|
OVER CURRENT; THERMAL
|
Input Characteristics |
STANDARD
|
STANDARD
|
Interface IC Type |
BUFFER OR INVERTER BASED PERIPHERAL DRIVER
|
BUFFER OR INVERTER BASED PERIPHERAL DRIVER
|
JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
JESD-609 Code |
e3
|
e3
|
Length |
5 mm
|
5 mm
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
2
|
2
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Characteristics |
OPEN-DRAIN
|
OPEN-DRAIN
|
Output Current Flow Direction |
SINK
|
SINK
|
Output Peak Current Limit-Nom |
0.1 A
|
0.1 A
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
TSSOP
|
Package Equivalence Code |
TSSOP16,.25
|
TSSOP16,.25
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Seated Height-Max |
1.1 mm
|
1.1 mm
|
Supply Current-Max |
0.32 mA
|
0.32 mA
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
2.7 V
|
2.7 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
MATTE TIN
|
MATTE TIN
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Turn-on Time |
10000 µs
|
10000 µs
|
Width |
4.4 mm
|
4.4 mm
|
Base Number Matches |
2
|
2
|
Samacsys Manufacturer |
|
Microchip
|
Peak Reflow Temperature (Cel) |
|
260
|
|
|
|
Compare MIC2547-1YTS-TR with alternatives
Compare MIC2547-2YTS-TR with alternatives