MIC33M356-SAYMP-TR
vs
LX7157BCLD
feature comparison
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI CORP
|
| Package Description |
,
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
11 Weeks
|
|
| Date Of Intro |
2020-05-28
|
|
| Samacsys Manufacturer |
Microchip
|
|
| Additional Feature |
ADJ O/P FROM 0.6V TO 3.84V
|
|
| Analog IC - Other Type |
SWITCHING REGULATOR
|
SWITCHING REGULATOR
|
| Control Technique |
PULSE WIDTH MODULATION
|
|
| Input Voltage-Max |
5.5 V
|
|
| Input Voltage-Min |
2.4 V
|
|
| Input Voltage-Nom |
5 V
|
|
| JESD-30 Code |
R-PQMA-N24
|
R-PDSO-N12
|
| JESD-609 Code |
e3
|
|
| Length |
4.5 mm
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
24
|
12
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Output Current-Max |
3 A
|
3 A
|
| Output Voltage-Max |
3.84 V
|
|
| Output Voltage-Min |
0.6 V
|
|
| Output Voltage-Nom |
1 V
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QMA
|
SON
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
MICROELECTRONIC ASSEMBLY
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Seated Height-Max |
1.9 mm
|
|
| Supply Current-Max (Isup) |
0.1 mA
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
|
| Surface Mount |
YES
|
YES
|
| Switcher Configuration |
BUCK
|
|
| Switching Frequency-Max |
2200 kHz
|
|
| Temperature Grade |
AUTOMOTIVE
|
OTHER
|
| Terminal Finish |
Matte Tin (Sn)
|
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
3 mm
|
|
| Base Number Matches |
1
|
2
|
| Rohs Code |
|
Yes
|
| Control Mode |
|
CURRENT-MODE
|
| Package Equivalence Code |
|
SOLCC12,.12,20
|
| Qualification Status |
|
Not Qualified
|
|
|
|
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