MNR18E0APJ681 vs TSN3AJ681 feature comparison

MNR18E0APJ681 ROHM Semiconductor

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TSN3AJ681 Tateyama Kagaku Group

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer ROHM CO LTD TATEYAMA KAGAKU GROUP
Package Description CHIP
Reach Compliance Code compliant unknown
Construction Rectangular Chip
Element Power Dissipation 0.063 W
First Element Resistance 680 Ω
JESD-609 Code e3
Mounting Feature SURFACE MOUNT
Network Type ISOLATED ISOLATED
Number of Elements 1
Number of Functions 8
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Height 0.45 mm 0.45 mm
Package Length 3.8 mm 3.8 mm
Package Shape RECTANGULAR PACKAGE
Package Style SMT SMT
Package Width 1.6 mm 1.6 mm
Packing Method TR, PAPER, 7 INCH Bulk
Rated Temperature 70 °C
Resistance 680 Ω 680 Ω
Resistor Type ARRAY/NETWORK RESISTOR ARRAY/NETWORK RESISTOR
Second/Last Element Resistance 680 Ω
Size Code 0615 1506
Surface Mount YES
Technology METAL GLAZE/THICK FILM METAL GLAZE/THICK FILM
Temperature Coefficient 200 ppm/°C 200 ppm/°C
Terminal Finish Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape WRAPAROUND
Tolerance 5% 5%
Working Voltage 25 V 25 V
Base Number Matches 1 1
ECCN Code EAR99
Rated Power Dissipation (P) 0.063 W

Compare MNR18E0APJ681 with alternatives

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