MNR18E0APJ681
vs
TSN3AJ681
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
Rohs Code
Yes
Yes
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
ROHM CO LTD
TATEYAMA KAGAKU GROUP
Package Description
CHIP
Reach Compliance Code
compliant
unknown
Construction
Rectangular
Chip
Element Power Dissipation
0.063 W
First Element Resistance
680 Ω
JESD-609 Code
e3
Mounting Feature
SURFACE MOUNT
Network Type
ISOLATED
ISOLATED
Number of Elements
1
Number of Functions
8
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Package Height
0.45 mm
0.45 mm
Package Length
3.8 mm
3.8 mm
Package Shape
RECTANGULAR PACKAGE
Package Style
SMT
SMT
Package Width
1.6 mm
1.6 mm
Packing Method
TR, PAPER, 7 INCH
Bulk
Rated Temperature
70 °C
Resistance
680 Ω
680 Ω
Resistor Type
ARRAY/NETWORK RESISTOR
ARRAY/NETWORK RESISTOR
Second/Last Element Resistance
680 Ω
Size Code
0615
1506
Surface Mount
YES
Technology
METAL GLAZE/THICK FILM
METAL GLAZE/THICK FILM
Temperature Coefficient
200 ppm/°C
200 ppm/°C
Terminal Finish
Tin (Sn) - with Nickel (Ni) barrier
Terminal Shape
WRAPAROUND
Tolerance
5%
5%
Working Voltage
25 V
25 V
Base Number Matches
1
1
ECCN Code
EAR99
Rated Power Dissipation (P)
0.063 W
Compare MNR18E0APJ681 with alternatives
Compare TSN3AJ681 with alternatives