MPC5554MZP132 vs MPC5554MVR132 feature comparison

MPC5554MZP132 Freescale Semiconductor

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MPC5554MVR132 Rochester Electronics LLC

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC ROCHESTER ELECTRONICS LLC
Part Package Code BGA BGA
Package Description 27 X 27 MM, 1 MM PITCH, PLASTIC, MS-034AAL-1, TEBGA-416 27 X 27 MM, 1 MM PITCH, LEAD FREE, PLASTIC, MS-034AAL-1, TEPBGA-416
Pin Count 416 416
Reach Compliance Code not_compliant unknown
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Samacsys Manufacturer NXP
Has ADC YES YES
Additional Feature IT ALSO REQUIRES 3.3V SUPPLY
Address Bus Width 24 24
Bit Size 32 32
Clock Frequency-Max 20 MHz 20 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width 32 32
JESD-30 Code S-PBGA-B416 S-PBGA-B416
JESD-609 Code e0 e1
Length 27 mm 27 mm
Moisture Sensitivity Level 3 3
Number of Terminals 416 416
On Chip Program ROM Width 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HBGA BGA
Package Equivalence Code BGA416,26X26,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, HEAT SINK/SLUG GRID ARRAY
Peak Reflow Temperature (Cel) 245 260
Qualification Status Not Qualified
RAM (bytes) 65536
ROM (words) 2097152
ROM Programmability FLASH FLASH
Seated Height-Max 2.55 mm 2.55 mm
Speed 132 MHz 132 MHz
Supply Current-Max 600 mA
Supply Voltage-Max 1.65 V 1.65 V
Supply Voltage-Min 1.35 V 1.35 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish TIN LEAD SILVER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30 40
Width 27 mm 27 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 2 1

Compare MPC5554MZP132 with alternatives

Compare MPC5554MVR132 with alternatives