MPC8358ECZUADDEA vs MPC8360ECVVAGDGA feature comparison

MPC8358ECZUADDEA Freescale Semiconductor

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MPC8360ECVVAGDGA Freescale Semiconductor

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Rohs Code No Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC FREESCALE SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description 37.50 X 37.50 MM, 1.46 MM HEIGHT, 1 MM PITCH, TBGA-740 37.50 X 37.50 MM, 1.46 MM HEIGHT, 1 MM PITCH, LEAD FREE, TBGA-740
Pin Count 740 740
Reach Compliance Code not_compliant compliant
ECCN Code 5A002 5A002
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 66.67 MHz 66.67 MHz
External Data Bus Width 32 32
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B740 S-PBGA-B740
JESD-609 Code e0 e2
Length 37.5 mm 37.5 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3 3
Number of Terminals 740 740
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA740,37X37,40 BGA740,37X37,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.69 mm 1.69 mm
Speed 266 MHz 400 MHz
Supply Voltage-Max 1.26 V 1.26 V
Supply Voltage-Min 1.14 V 1.14 V
Supply Voltage-Nom 1.2 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Finish Tin/Lead/Silver (Sn/Pb/Ag)
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 40 40
Width 37.5 mm 37.5 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 1 1
Pbfree Code Yes
Samacsys Manufacturer NXP

Compare MPC8358ECZUADDEA with alternatives

Compare MPC8360ECVVAGDGA with alternatives