MPC8360EVVALFH vs MPC8360ECVVAGDGA feature comparison

MPC8360EVVALFH NXP Semiconductors

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MPC8360ECVVAGDGA Freescale Semiconductor

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Rohs Code Yes Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer NXP SEMICONDUCTORS FREESCALE SEMICONDUCTOR INC
Package Description 37.50 X 37.50 MM, 1.46 MM HEIGHT, 1 MM PITCH, LEAD FREE, TBGA-740 37.50 X 37.50 MM, 1.46 MM HEIGHT, 1 MM PITCH, LEAD FREE, TBGA-740
Reach Compliance Code compliant compliant
ECCN Code 3A991.A.2 5A002
HTS Code 8542.31.00.01 8542.31.00.01
Address Bus Width 32 32
Bit Size 32 32
Boundary Scan YES YES
Clock Frequency-Max 66.67 MHz 66.67 MHz
External Data Bus Width 32 32
Format FLOATING POINT FLOATING POINT
Integrated Cache YES YES
JESD-30 Code S-PBGA-B740 S-PBGA-B740
JESD-609 Code e1 e2
Length 37.5 mm 37.5 mm
Low Power Mode YES YES
Moisture Sensitivity Level 3 3
Number of Terminals 740 740
Operating Temperature-Max 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.69 mm 1.69 mm
Speed 667 MHz 400 MHz
Supply Voltage-Max 1.35 V 1.26 V
Supply Voltage-Min 1.25 V 1.14 V
Supply Voltage-Nom 1.3 V 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 37.5 mm 37.5 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 2 1
Pbfree Code Yes
Part Package Code BGA
Pin Count 740
Samacsys Manufacturer NXP
Package Equivalence Code BGA740,37X37,40
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40

Compare MPC8360EVVALFH with alternatives

Compare MPC8360ECVVAGDGA with alternatives