MPC850SEZT66
vs
IBM25PPC750CXEJP5513T
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA INC
|
IBM MICROELECTRONICS
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
BGA,
|
LBGA, BGA256,20X20,50
|
| Pin Count |
256
|
256
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| JESD-30 Code |
R-PBGA-B256
|
S-PBGA-B256
|
| Number of Terminals |
256
|
256
|
| Operating Temperature-Max |
70 °C
|
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
LBGA
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY, LOW PROFILE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Nom |
3.3 V
|
1.8 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
No
|
| ECCN Code |
|
3A991.A.2
|
| Address Bus Width |
|
32
|
| Bit Size |
|
32
|
| Boundary Scan |
|
YES
|
| Clock Frequency-Max |
|
133 MHz
|
| External Data Bus Width |
|
64
|
| Format |
|
FLOATING POINT
|
| Integrated Cache |
|
YES
|
| Length |
|
27 mm
|
| Low Power Mode |
|
YES
|
| Package Equivalence Code |
|
BGA256,20X20,50
|
| Seated Height-Max |
|
1.666 mm
|
| Speed |
|
533 MHz
|
| Supply Voltage-Max |
|
1.9 V
|
| Supply Voltage-Min |
|
1.7 V
|
| Terminal Pitch |
|
1.27 mm
|
| Width |
|
27 mm
|
|
|
|
Compare MPC850SEZT66 with alternatives
Compare IBM25PPC750CXEJP5513T with alternatives