MPC850SEZT66 vs AT75C221-C256 feature comparison

MPC850SEZT66 Motorola Mobility LLC

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AT75C221-C256 Atmel Corporation

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer MOTOROLA INC ATMEL CORP
Part Package Code BGA BGA
Package Description BGA, BGA, BGA256,20X20,50
Pin Count 256 256
Reach Compliance Code unknown compliant
HTS Code 8542.31.00.01 8542.31.00.01
JESD-30 Code R-PBGA-B256 S-PBGA-B256
Number of Terminals 256 256
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape RECTANGULAR SQUARE
Package Style GRID ARRAY GRID ARRAY
Qualification Status Not Qualified Not Qualified
Supply Voltage-Nom 3.3 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form BALL BALL
Terminal Position BOTTOM BOTTOM
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Base Number Matches 2 2
Pbfree Code No
Rohs Code No
Address Bus Width 24
Bit Size 32
Boundary Scan YES
Clock Frequency-Max 16 MHz
External Data Bus Width 32
Format FIXED POINT
JESD-609 Code e0
Length 24 mm
Low Power Mode NO
Package Equivalence Code BGA256,20X20,50
Seated Height-Max 2.34 mm
Speed 40 MHz
Terminal Finish TIN LEAD
Terminal Pitch 1.27 mm
Width 24 mm

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Compare AT75C221-C256 with alternatives