MPC850SEZT66
vs
MC9328MXLVM20
feature comparison
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
MOTOROLA INC
|
ROCHESTER ELECTRONICS LLC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
BGA,
|
14 X 14 MM, 1.30 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, MAPBGA-256
|
| Pin Count |
256
|
256
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
|
| JESD-30 Code |
R-PBGA-B256
|
S-PBGA-B256
|
| Number of Terminals |
256
|
256
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
LFBGA
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY, LOW PROFILE, FINE PITCH
|
| Qualification Status |
Not Qualified
|
COMMERCIAL
|
| Supply Voltage-Nom |
3.3 V
|
1.9 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
2
|
5
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Additional Feature |
|
ALSO REQUIRES 3.3V SUPPLY
|
| Address Bus Width |
|
25
|
| Bit Size |
|
32
|
| Boundary Scan |
|
YES
|
| Clock Frequency-Max |
|
16 MHz
|
| External Data Bus Width |
|
32
|
| Format |
|
FIXED POINT
|
| Integrated Cache |
|
YES
|
| JESD-609 Code |
|
e1
|
| Length |
|
14 mm
|
| Low Power Mode |
|
YES
|
| Moisture Sensitivity Level |
|
3
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Seated Height-Max |
|
1.6 mm
|
| Speed |
|
200 MHz
|
| Supply Voltage-Max |
|
2 V
|
| Supply Voltage-Min |
|
1.8 V
|
| Terminal Finish |
|
TIN SILVER COPPER
|
| Terminal Pitch |
|
0.8 mm
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
| Width |
|
14 mm
|
|
|
|
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