MT28F640J3BS-115 vs MT28F640J3BS-115MET feature comparison

MT28F640J3BS-115 Micron Technology Inc

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MT28F640J3BS-115MET Micron Technology Inc

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC MICRON TECHNOLOGY INC
Part Package Code BGA BGA
Package Description 10 X 13 MM, 1 MM PITCH, LEAD FREE, FBGA-64 TBGA,
Pin Count 64 64
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 115 ns 115 ns
Alternate Memory Width 8
JESD-30 Code R-PBGA-B64 R-PBGA-B64
JESD-609 Code e1 e1
Length 13 mm 13 mm
Memory Density 67108864 bit 67108864 bit
Memory IC Type FLASH FLASH
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 64 64
Number of Words 4194304 words 4194304 words
Number of Words Code 4000000 4000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C
Organization 4MX16 4MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TBGA TBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE GRID ARRAY, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Programming Voltage 2.7 V 2.7 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER INDUSTRIAL
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Type NOR TYPE
Width 10 mm 10 mm
Base Number Matches 4 1
Rohs Code Yes
Peak Reflow Temperature (Cel) 260

Compare MT28F640J3BS-115 with alternatives

Compare MT28F640J3BS-115MET with alternatives