MT58LC64K18B2LG-11L vs MCM63P532TQ7 feature comparison

MT58LC64K18B2LG-11L Micron Technology Inc

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MCM63P532TQ7 Motorola Mobility LLC

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC MOTOROLA INC
Part Package Code QFP QFP
Package Description 14 X 20 MM, PLASTIC, TQFP-100 LQFP, QFP100,.63X.87
Pin Count 100 100
Reach Compliance Code not_compliant unknown
ECCN Code 3A991.B.2.A 3A991.B.2.B
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 11 ns 7 ns
Additional Feature OPTIONAL INTERLEAVED OR LINEAR BURST OUTPUT REGISTER; SELF-TIMED WRITE; BURST COUNTER; BYTE WRITE
I/O Type COMMON COMMON
JESD-30 Code R-PQFP-G100 R-PQFP-G100
JESD-609 Code e0 e0
Length 20 mm 20 mm
Memory Density 1179648 bit 1048576 bit
Memory IC Type STANDARD SRAM CACHE SRAM
Memory Width 18 32
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 100 100
Number of Words 65536 words 32768 words
Number of Words Code 64000 32000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 64KX18 32KX32
Output Characteristics 3-STATE 3-STATE
Output Enable YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP LQFP
Package Equivalence Code QFP100,.7X.9 QFP100,.63X.87
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK, LOW PROFILE FLATPACK, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 1.6 mm
Standby Voltage-Min 2 V 3.14 V
Supply Current-Max 0.225 mA
Supply Voltage-Max (Vsup) 3.465 V 3.6 V
Supply Voltage-Min (Vsup) 3.135 V 3.135 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD Tin/Lead (Sn/Pb)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position QUAD QUAD
Width 14 mm 14 mm
Base Number Matches 3 2

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