N256S0818HDAT2-16I vs CY14B256Q2-LHXIT feature comparison

N256S0818HDAT2-16I onsemi

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CY14B256Q2-LHXIT Cypress Semiconductor

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ON SEMICONDUCTOR CYPRESS SEMICONDUCTOR CORP
Part Package Code SOIC DFN
Package Description TSSOP, 0.300 INCH, ROHS COMPLIANT, MO-240, DFN-8
Pin Count 8 8
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
JESD-30 Code R-PDSO-G8 R-PDSO-N8
Length 4.4 mm 6 mm
Memory Density 262144 bit 262144 bit
Memory IC Type STANDARD SRAM NON-VOLATILE SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 32768 words 32768 words
Number of Words Code 32000 32000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 32KX8 32KX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP HVSON
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Parallel/Serial SERIAL SERIAL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 0.8 mm
Supply Voltage-Max (Vsup) 1.95 V 3.6 V
Supply Voltage-Min (Vsup) 1.7 V 2.7 V
Supply Voltage-Nom (Vsup) 1.8 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING NO LEAD
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position DUAL DUAL
Width 3 mm 5 mm
Base Number Matches 1 1
Rohs Code Yes
Package Equivalence Code SOLCC8,.25
Peak Reflow Temperature (Cel) NOT SPECIFIED
Standby Current-Max 0.005 A
Supply Current-Max 0.01 mA
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare N256S0818HDAT2-16I with alternatives

Compare CY14B256Q2-LHXIT with alternatives