NE555N
vs
ICM7555CD,602
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
SIGNETICS CORP
|
NXP SEMICONDUCTORS
|
| Package Description |
DIP-8
|
SOP, SOP8,.25
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
PULSE; RECTANGULAR
|
PULSE
|
| JESD-30 Code |
R-PDIP-T8
|
R-PDSO-G8
|
| JESD-609 Code |
e0
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Output Frequency-Max |
0.5 MHz
|
0.5 MHz
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SOP
|
| Package Equivalence Code |
DIP8,.3
|
SOP8,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max (Vsup) |
16 V
|
16 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
BIPOLAR
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
2
|
1
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
8
|
| Manufacturer Package Code |
|
SOT96-1
|
| Length |
|
4.9 mm
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Seated Height-Max |
|
1.75 mm
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
| Width |
|
3.9 mm
|
|
|
|
Compare NE555N with alternatives
Compare ICM7555CD,602 with alternatives
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ICM7555CD,602 vs SA555D
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-
ICM7555CD,602 vs SE555DT
-
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-
ICM7555CD,602 vs NCV1455BDR2
-
ICM7555CD,602 vs ICM7555CD/01,118
-
ICM7555CD,602 vs SE555D
-
ICM7555CD,602 vs MC1455BDR2
-
ICM7555CD,602 vs ICM7555ID/01,112