P89LPC9321FDH vs P89LPC932A1FA feature comparison

P89LPC9321FDH NXP Semiconductors

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P89LPC932A1FA NXP Semiconductors

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code TSSOP LCC
Package Description 4.40 MM, PLASTIC, MO-153, SOT361-1, TSSOP-28 PLASTIC, MS-018, SOT-261-2, LCC-28
Pin Count 28 28
Reach Compliance Code unknown unknown
HTS Code 8542.31.00.01 8542.31.00.01
Has ADC NO NO
Address Bus Width
Bit Size 8 8
CPU Family 8051 8051
Clock Frequency-Max 18 MHz 12 MHz
DAC Channels NO NO
DMA Channels NO NO
External Data Bus Width
JESD-30 Code R-PDSO-G28 S-PQCC-J28
JESD-609 Code e4 e3
Length 9.7 mm 11.505 mm
Moisture Sensitivity Level 2 1
Number of I/O Lines 26 26
Number of Terminals 28 28
On Chip Program ROM Width 8 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP QCCJ
Package Equivalence Code TSSOP28,.25 LDCC28,.5SQ
Package Shape RECTANGULAR SQUARE
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH CHIP CARRIER
Peak Reflow Temperature (Cel) 260 245
Qualification Status Not Qualified Not Qualified
RAM (bytes) 768 768
ROM (words) 8192 8192
ROM Programmability FLASH FLASH
Seated Height-Max 1.1 mm 4.57 mm
Speed 18 MHz 12 MHz
Supply Current-Max 23 mA 18 mA
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 3 V 3 V
Supply Voltage-Nom 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish NICKEL PALLADIUM GOLD Tin (Sn)
Terminal Form GULL WING J BEND
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position DUAL QUAD
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Width 4.4 mm 11.505 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER MICROCONTROLLER
Base Number Matches 3 4

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Compare P89LPC932A1FA with alternatives