P89LPC9321FDH
vs
P89LPC932A1FHN,151
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Part Package Code |
TSSOP
|
QFN
|
| Package Description |
4.40 MM, PLASTIC, MO-153, SOT361-1, TSSOP-28
|
6 X 6 MM, 0.85 MM HEIGHT, PLASTIC, MO-220, SOT-788-1, HVQFN-28
|
| Pin Count |
28
|
28
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
NO
|
NO
|
| Address Bus Width |
|
|
| Bit Size |
8
|
8
|
| CPU Family |
8051
|
|
| Clock Frequency-Max |
18 MHz
|
12 MHz
|
| DAC Channels |
NO
|
NO
|
| DMA Channels |
NO
|
NO
|
| External Data Bus Width |
|
|
| JESD-30 Code |
R-PDSO-G28
|
S-PQCC-N28
|
| JESD-609 Code |
e4
|
e4
|
| Length |
9.7 mm
|
6 mm
|
| Moisture Sensitivity Level |
2
|
1
|
| Number of I/O Lines |
26
|
26
|
| Number of Terminals |
28
|
28
|
| On Chip Program ROM Width |
8
|
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
HVQCCN
|
| Package Equivalence Code |
TSSOP28,.25
|
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (bytes) |
768
|
|
| ROM (words) |
8192
|
|
| ROM Programmability |
FLASH
|
FLASH
|
| Seated Height-Max |
1.1 mm
|
1 mm
|
| Speed |
18 MHz
|
12 MHz
|
| Supply Current-Max |
23 mA
|
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
3 V
|
2.4 V
|
| Supply Voltage-Nom |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
4.4 mm
|
6 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
3
|
1
|
| Manufacturer Package Code |
|
SOT788-1
|
| Samacsys Manufacturer |
|
NXP
|
|
|
|
Compare P89LPC9321FDH with alternatives
Compare P89LPC932A1FHN,151 with alternatives
-
P89LPC932A1FHN,151 vs P89LPC932A1FHN
-
P89LPC932A1FHN,151 vs P89LPC932FDH
-
P89LPC932A1FHN,151 vs P89LPC9321FA
-
P89LPC932A1FHN,151 vs P89LPC9321FA,112
-
P89LPC932A1FHN,151 vs P89LPC932BDH
-
P89LPC932A1FHN,151 vs P89LPC932A1FA,129
-
P89LPC932A1FHN,151 vs P89LPC932A1FA,112
-
P89LPC932A1FHN,151 vs P89LPC932A1FDH,529
-
P89LPC932A1FHN,151 vs P89LPC9321FN,112