PCX755BVZFU400LE
vs
MPC755BPX400LX
feature comparison
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
THOMSON-CSF SEMICONDUCTORS
|
MOTOROLA INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
,
|
BGA,
|
| Pin Count |
360
|
360
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Additional Feature |
400 MHZ TO BE CONFIRMED
|
|
| Address Bus Width |
32
|
32
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
100 MHz
|
100 MHz
|
| External Data Bus Width |
64
|
64
|
| Format |
FLOATING POINT
|
FLOATING POINT
|
| Integrated Cache |
YES
|
YES
|
| JESD-30 Code |
S-PBGA-B360
|
S-PBGA-B360
|
| Low Power Mode |
YES
|
YES
|
| Number of Terminals |
360
|
360
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Speed |
400 MHz
|
400 MHz
|
| Supply Voltage-Max |
2.1 V
|
2.1 V
|
| Supply Voltage-Min |
1.9 V
|
1.9 V
|
| Supply Voltage-Nom |
2 V
|
2 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
1
|
1
|
| Length |
|
25 mm
|
| Package Code |
|
BGA
|
| Seated Height-Max |
|
2.77 mm
|
| Terminal Pitch |
|
1.27 mm
|
| Width |
|
25 mm
|
|
|
|
Compare PCX755BVZFU400LE with alternatives
Compare MPC755BPX400LX with alternatives