Part Details for PCX755BVZFU400LE by Thales Group
Overview of PCX755BVZFU400LE by Thales Group
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for PCX755BVZFU400LE
PCX755BVZFU400LE CAD Models
PCX755BVZFU400LE Part Data Attributes:
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PCX755BVZFU400LE
Thales Group
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Datasheet
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PCX755BVZFU400LE
Thales Group
RISC Microprocessor, 32-Bit, 400MHz, CMOS, PBGA360, 25 X 25 MM, FLIP CHIP, PLASTIC, BGA-360
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| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | THOMSON-CSF SEMICONDUCTORS | |
| Part Package Code | BGA | |
| Package Description | , | |
| Pin Count | 360 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Additional Feature | 400 MHZ TO BE CONFIRMED | |
| Address Bus Width | 32 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 100 MHz | |
| External Data Bus Width | 64 | |
| Format | FLOATING POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B360 | |
| Low Power Mode | YES | |
| Number of Terminals | 360 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Qualification Status | Not Qualified | |
| Speed | 400 MHz | |
| Supply Voltage-Max | 2.1 V | |
| Supply Voltage-Min | 1.9 V | |
| Supply Voltage-Nom | 2 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for PCX755BVZFU400LE
This table gives cross-reference parts and alternative options found for PCX755BVZFU400LE. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of PCX755BVZFU400LE, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| XPC755BPX400LER2 | 32-BIT, 400MHz, RISC PROCESSOR, PBGA360, PLASTIC, BGA-360 | Freescale Semiconductor | PCX755BVZFU400LE vs XPC755BPX400LER2 |
| PC755VZF400LE | RISC Microprocessor, 32-Bit, 400MHz, CMOS, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, FLIP CHIP, PLASTIC, BGA-360 | Atmel Corporation | PCX755BVZFU400LE vs PC755VZF400LE |
| PCX755BMZFU400LE | RISC Microprocessor, 32-Bit, 400MHz, CMOS, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-360 | Atmel Corporation | PCX755BVZFU400LE vs PCX755BMZFU400LE |
| XPC750PRX400RE | 32-BIT, 400MHz, RISC PROCESSOR, CBGA360 | NXP Semiconductors | PCX755BVZFU400LE vs XPC750PRX400RE |
| MPC755BPX400LX | 32-BIT, 400MHz, RISC PROCESSOR, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-360 | Motorola Mobility LLC | PCX755BVZFU400LE vs MPC755BPX400LX |
| PCX755VZF400LE | RISC Microprocessor, 32-Bit, 400MHz, CMOS, PBGA360, 25 X 25 MM, 2.77MM HEIGHT, 1.27MM PITCH, PLASTIC, FCBGA-360 | e2v technologies | PCX755BVZFU400LE vs PCX755VZF400LE |
| PC755MGH400LE | RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360 | e2v technologies | PCX755BVZFU400LE vs PC755MGH400LE |
| XPC755BRX400LE | 32-BIT, 400MHz, RISC PROCESSOR, CBGA360, CERAMIC, BGA-360 | Freescale Semiconductor | PCX755BVZFU400LE vs XPC755BRX400LE |
| XPC755BPX400LE | 32-BIT, 400MHz, RISC PROCESSOR, PBGA360, PLASTIC, BGA-360 | Freescale Semiconductor | PCX755BVZFU400LE vs XPC755BPX400LE |
| MPC755BPX400LE | RISC Microprocessor, 32-Bit, 400MHz, CMOS, PBGA360, 25 X 25 MM, PLASTIC, BGA-360 | Motorola Semiconductor Products | PCX755BVZFU400LE vs MPC755BPX400LE |