PUMD9
vs
EMD9FHAT2R
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
NEXPERIA
|
ROHM CO LTD
|
| Package Description |
PLASTIC, SC-88, 6 PIN
|
SMALL OUTLINE, R-PDSO-F6
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| Date Of Intro |
1999-01-08
|
|
| Samacsys Manufacturer |
Nexperia
|
ROHM Semiconductor
|
| Additional Feature |
BUILT-IN BIAS RESISTOR RATIO IS 4.7
|
BUILT IN BIAS RESISTANCE RATIO IS 4.7
|
| Collector Current-Max (IC) |
0.1 A
|
0.1 A
|
| Collector-Base Capacitance-Max |
2.5 pF
|
|
| Collector-Emitter Voltage-Max |
50 V
|
50 V
|
| Configuration |
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR
|
SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR
|
| DC Current Gain-Min (hFE) |
100
|
68
|
| JESD-30 Code |
R-PDSO-G6
|
R-PDSO-F6
|
| JESD-609 Code |
e3
|
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Elements |
2
|
2
|
| Number of Terminals |
6
|
6
|
| Operating Temperature-Max |
150 °C
|
|
| Operating Temperature-Min |
-65 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Polarity/Channel Type |
NPN AND PNP
|
NPN AND PNP
|
| Power Dissipation-Max (Abs) |
0.3 W
|
|
| Reference Standard |
AEC-Q101; IEC-60134
|
AEC-Q101
|
| Surface Mount |
YES
|
YES
|
| Terminal Finish |
TIN
|
|
| Terminal Form |
GULL WING
|
FLAT
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
10
|
| Transistor Application |
SWITCHING
|
SWITCHING
|
| Transistor Element Material |
SILICON
|
SILICON
|
| Transition Frequency-Nom (fT) |
230 MHz
|
250 MHz
|
| VCEsat-Max |
0.1 V
|
|
| Base Number Matches |
15
|
1
|
| Factory Lead Time |
|
13 Weeks
|
|
|
|
Compare PUMD9 with alternatives
Compare EMD9FHAT2R with alternatives